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Cinterion Introduces PH8 M2M Module for Wireless Connectivity

Cinterion, the global leader in cellular machine-to-machine (M2M) communication modules and a Gemalto (Euronext NL 0000400653 GTO) company, today launched the PH8, its new flagship HSPA+ M2M module.

10 Dec 2010

Nemotek Technologie Integrates Automated Testing Systems for Wafer-Level Optical Solutions

Nemotek Technologie, a manufacturer of customized wafer-level cameras (WLC), today announced the integration of new fully automated testing systems to its manufacturing process.

9 Dec 2010

Ambarella Sells New A7 Hybrid Camera Using Samsung’s 45nm Process Technology

Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, and Ambarella, a leader in low-power, high-definition video compression and image processing semiconductors, today announced the availability of Ambarella’s new A7 hybrid camera system-on-chip (SoC) product utilizing Samsung’s latest 45-nanometer (nm) low power (LP) process technology.

From Samsung Electronics 9 Dec 2010

eASIC Launches Value Shuttle Program for 45nm Nextreme-2 NEW ASIC Designs

eASIC Corporation, a provider of NEW ASIC devices, today introduced a Value Shuttle™ program that lowers the entry cost for 45nm ASIC designs.

9 Dec 2010

Breakthrough Towards Lab-on-Chip System for Fast Detection of Single Nucleotide Variations in DNA

Panasonic, core partner within imec’s Human++ program, and imec today presented at the International Electron Devices Meeting in San Francisco various critical components of a biomedical lab-on-chip sensor enabling...

From IMEC 8 Dec 2010

Magma's Talus System Adopted by NetLogic Microsystems for 28-nm Designs

Magma® Design Automation Inc. a provider of chip design software, today announced that NetLogic Microsystems Inc. a worldwide leader in high-performance intelligent semiconductor solutions for Internet networks, has selected Talus® for implementation of its next-generation knowledge-based processor and physical layer products.

8 Dec 2010

SEMATECH and Nanosys Join to Extend Non-Volatile Memory Technologies

SEMATECH today announced that Nanosys, Inc., an advanced materials architect, has joined its Front End Processes (FEP) program, and will work with SEMATECH to develop new materials and processing techniques for extending flash memory technologies.

From Shoei Electronic Materials, Inc 8 Dec 2010

Researchers Use Carbon Nanotubes to Build Microelectronic Devices

Given their outstanding mechanical and electrical properties, carbon nanotubes are attractive building blocks for next-generation nanoelectromechanical devices, including high-performance sensors, logic devices, and memory elements.

8 Dec 2010

SiPort Selects Berkeley Design's AFS Platform to Deliver SPICE Accuracy at Nanoscale

Berkeley Design Automation, Inc., the nanometer circuit verification leader, today announced that SiPort Inc., a fabless semiconductor company developing single-chip nm CMOS audio/data broadcast receivers, has selected the company’s AFS Platform for block-level characterization, top-level verification, and device noise analysis.

8 Dec 2010

Imec Reports Ultra-Thin Solar Blind EUV Imager

Today at the International Electron Devices Meeting in San Francisco imec presents an ultra-thin hybrid AlGaN-on-Si-based extreme ultraviolet (EUV) imager with only 10µm pixel-to-pixel pitch. The wide-bandgap mater...

From IMEC 7 Dec 2010