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Breakthrough Towards Lab-on-Chip System for Fast Detection of Single Nucleotide Variations in DNA

Panasonic, core partner within imec’s Human++ program, and imec today presented at the International Electron Devices Meeting in San Francisco various critical components of a biomedical lab-on-chip sensor enabling...

From IMEC 8 Dec 2010

Magma's Talus System Adopted by NetLogic Microsystems for 28-nm Designs

Magma® Design Automation Inc. a provider of chip design software, today announced that NetLogic Microsystems Inc. a worldwide leader in high-performance intelligent semiconductor solutions for Internet networks, has selected Talus® for implementation of its next-generation knowledge-based processor and physical layer products.

8 Dec 2010

SEMATECH and Nanosys Join to Extend Non-Volatile Memory Technologies

SEMATECH today announced that Nanosys, Inc., an advanced materials architect, has joined its Front End Processes (FEP) program, and will work with SEMATECH to develop new materials and processing techniques for extending flash memory technologies.

From Shoei Electronic Materials, Inc 8 Dec 2010

Researchers Use Carbon Nanotubes to Build Microelectronic Devices

Given their outstanding mechanical and electrical properties, carbon nanotubes are attractive building blocks for next-generation nanoelectromechanical devices, including high-performance sensors, logic devices, and memory elements.

8 Dec 2010

SiPort Selects Berkeley Design's AFS Platform to Deliver SPICE Accuracy at Nanoscale

Berkeley Design Automation, Inc., the nanometer circuit verification leader, today announced that SiPort Inc., a fabless semiconductor company developing single-chip nm CMOS audio/data broadcast receivers, has selected the company’s AFS Platform for block-level characterization, top-level verification, and device noise analysis.

8 Dec 2010

Imec Reports Ultra-Thin Solar Blind EUV Imager

Today at the International Electron Devices Meeting in San Francisco imec presents an ultra-thin hybrid AlGaN-on-Si-based extreme ultraviolet (EUV) imager with only 10µm pixel-to-pixel pitch. The wide-bandgap mater...

From IMEC 7 Dec 2010

Panasonic and imec Present Innovative SiGe Thin Film Packaged SOI-Based MEMS Resonator

Panasonic and imec present at the International Electron Devices Meeting in San Francisco an innovative SiGe (silicon germanium) thin film packaged SOI-based MEMS resonator featuring an industry-record Q factor combined ...

From IMEC 7 Dec 2010

Research Team Develops Process for Precise Control of Channel Dopants

Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, and researchers from Waseda University in Tokyo today announced they have developed the process and materials for precisely controlling both the amount and the position of channel dopants.

7 Dec 2010

Altera to Use TSMC's 28-nm Process Technology in Midrange Product Families

Altera Corporation today announced its 28-nm process technology strategy targeting its 28-nm product portfolio.

7 Dec 2010

Imec's Advanced CMOS Research Program Reports Promising Advances in Scaling Logic, DRAM and Non-Volatile Memory

At the International Electron Devices Meeting in San Francisco imec’s advanced CMOS research program reports promising advances in scaling logic, DRAM and non-volatile memory. A new device based on non-silicon chan...

From IMEC 6 Dec 2010