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Panasonic and imec Present Innovative SiGe Thin Film Packaged SOI-Based MEMS Resonator

Panasonic and imec present at the International Electron Devices Meeting in San Francisco an innovative SiGe (silicon germanium) thin film packaged SOI-based MEMS resonator featuring an industry-record Q factor combined ...

From IMEC 7 Dec 2010

Research Team Develops Process for Precise Control of Channel Dopants

Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, and researchers from Waseda University in Tokyo today announced they have developed the process and materials for precisely controlling both the amount and the position of channel dopants.

7 Dec 2010

Altera to Use TSMC's 28-nm Process Technology in Midrange Product Families

Altera Corporation today announced its 28-nm process technology strategy targeting its 28-nm product portfolio.

7 Dec 2010

Imec's Advanced CMOS Research Program Reports Promising Advances in Scaling Logic, DRAM and Non-Volatile Memory

At the International Electron Devices Meeting in San Francisco imec’s advanced CMOS research program reports promising advances in scaling logic, DRAM and non-volatile memory. A new device based on non-silicon chan...

From IMEC 6 Dec 2010

Global Specialty Foundry Chooses SPTS’ PVD Technology for Advanced Power Device Manufacturing

SPP Process Technology Systems (SPTS), a supplier of advanced capital equipment and process technologies for the global semiconductor and related markets, today announced an order win for its Sigma® fxPTM PVD system ...

6 Dec 2010

MEMS-Based AST5400 Pressure Sensor to Measure Pressures Up to 2,000 PSI

American Sensor Technologies, Inc. (AST) now offers the AST5400 wet / wet differential pressure sensor (also termed differential pressure transducer or transmitter) to measure line pressures up to 2,000 PSI with a turndown ratio of 15 to 1.

6 Dec 2010

Cadence Silicon Realization Technology Used in SMIC's 65-nm SoC Designs

Cadence Design Systems, Inc. a leader in global electronic design innovation, today announced that Semiconductor Manufacturing International Corporation the largest semiconductor foundry in China, has adopted Cadence® Silicon Realization products for the design-for-manufacturing (DFM) and low-power technology at the core of SMIC's 65-nanometer Reference Flow 4.1.

From Semiconductor Manufacturing International Corporation (SMIC) 6 Dec 2010

Gemalto’s CATRENE Project Recognised at European Nanoelectronics Forum

Gemalto the world leader in digital security, announces that the CATRENE Trusted Secure Computing project has won the “2010 Innovation award” at the Nanoelectronics Forum in Madrid.

4 Dec 2010

Tech Valley Is Becoming Hot Spot for Tech Companies

Mention the “Tech Valley” to someone and they could be forgiven for assuming that California’s Silicon Valley is the topic of conversation. The Tech Valley is located in eastern New York and, though it’s not as well known as its sexier West Coast cousin, it is becoming a hot spot for tech companies.

4 Dec 2010

Cadence Offers Reference Flow for TowerJazz’s 180-nm Power Management Process

TowerJazz today announced that Cadence® Design Systems is offering a complete Reference Flow for TowerJazz’s Analog/Mixed-Signal (AMS) 0.18-micron power management process using IC 6.1 SKILL-based process design kits (PDKs).

4 Dec 2010