Nanoelectronics News

RSS

Atrenta, CEA-Leti to Focus on Advanced Power Reduction and 3D Design

Atrenta Inc., the leading provider of Early Design Closure® solutions to radically improve design efficiency throughout the IC design flow, announced today the signing of a multi-year collaboration agreement with CEA-Leti, the Electronics and Information Technology Laboratory of the French Atomic Energy Commission.

From CEA-Leti 28 Oct 2010

Xilinx’ Stacked Silicon Interconnect Technology Delivers Power Efficiency Using FPGA Technology

Xilinx, Inc. (Nasdaq: XLNX) today announced the industry's first stacked silicon interconnect technology for delivering breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package for applications that require high-transistor and logic density, as well as tremendous levels of computational and bandwidth performance.

28 Oct 2010

Mattson’s Millios System Selected for Joint Projects with CNT's Leading IC Partners

Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that its Millios™ system, which has been upgraded with the latest temperature measurement and control features at the Fraunhofer Center Nanoelectronic Technologies (CNT), has been selected for joint projects with CNT's leading IC partners for the development of advanced millisecond anneal applications at the 3X nanometer technology nodes and below.

28 Oct 2010

Dongbu HiTek Wins AEC-Q100 Certifications for 180nm Mixed-Signal Process and EEPROM IP

Dongbu HiTek today confirmed that it has fully qualified its advanced 180nm Mixed-Signal (MS180) Process and EEPROM Intellectual Property (IP) to meet the rigorous quality/reliability criteria set forth in the automotive AEC-Q100 ‘Grade 0’ standard.

From Dongbu HiTek 28 Oct 2010

Collaborative Research on Nanoscale Electronics to Reduce Power Consumption

Today, Ecole Polytechnique Federale de Lausanne and IBM announced a major research initiative, with several leading academic and corporate research organizations across Europe, to address the alarming growth of energy consumption by electronic devices, ranging from mobile phones to laptops to televisions to supercomputers.

27 Oct 2010

New Method Use Water Molecules for Tuning Band Gap in Graphene

Researchers at Rensselaer Polytechnic Institute developed a new method for using water to tune the band gap of the nanomaterial graphene, opening the door to new graphene-based transistors and nanoelectronics.

From Rensselaer Polytechnic Institute 27 Oct 2010

NIST Hosts 2011Mobile Microrobotics Challenge

They’ve played soccer, run dashes and deftly inserted pegs into holes—all within a world that can fit inside a single grain of rice. Now, it’s time for microrobots—mechanical workhorses whose dime...

26 Oct 2010

Nanotechnology New Ventures Competition to be Held on March 25, 2011

Purdue University and the University of Notre Dame are teaming up with state officials to offer Indiana's first business plan competition targeting startup ventures and emerging companies in nanotechnology.

26 Oct 2010

Ultratech’s Laser Spike Anneal Tools to Support 45-nm Production Ramp

Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that a large foundry in Asia has placed a significant multi-system, follow-on order for its laser spike anneal (LSA) tools.

26 Oct 2010

Nanotechnology-Based Self-Assembly Process Addresses Problem in the Semiconductor Industry

Thanks to a microwave oven, the fundamental nanotechnology process of self assembly may soon replace the lithographic processing use to make the ubiquitous semi-conductor chips. By using microwaves, researchers at Can...

From National Institute for Nanotechnology 26 Oct 2010