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16 IMEC Authors Accepted for IEEE International Electron Devices Meeting

16 papers with imec authors were accepted for IEEE International Electron Devices Meeting (IEDM), December 6-8, 2010, in San Francisco. Both ITRS-related as well as More-than-Moore-related research papers have been accep...

From IMEC 19 Aug 2010

Asian Integrated Device Maker Orders Camtek’s Wafer Inspection Systems

Camtek Ltd. (NASDAQ and TASE: CAMT) ("Camtek"), announced today that it received follow-on order for multiple wafer inspection systems from a major Asian IDM (Integrated Device Maker). The systems will be insta...

19 Aug 2010

New Microelectronics Advertising Campaign for QA Professionals

Microelectronics have changed the lives of people around the globe in countless ways. Never before has such a wealth of information been so accessible to so many, and the children of today have an even more amazing wo...

19 Aug 2010

Imec Researchers Examine Gate Oxide Trapping

Using a new technique, researchers from imec, TU Vienna, and Infineon have shown that both electron and hole capture and emission times in SiO2 and HfO2 dielectrics are strongly thermally activated.

From IMEC 19 Aug 2010

Imec Establishes Metrology Method for Optimizing Etch Rate Uniformity in Transformer Coupled Plasma Reactor

Imec and KLA Tencor have established a metrology method for optimizing the etch rate uniformity (ERU) in a transformer coupled plasma (TCP) reactor. The proposed metrology method makes use of PVx2 sensor wafers.

From IMEC 19 Aug 2010

10 European R+D Project Consortia Coordinate Efforts in Silicon Photonics

Under the umbrella of the European Silicon Photonics Cluster, 10 European R+D project consortia coordinate their efforts in silicon photonics. Imec is involved in 7 of these consortia, which consist of research institute...

From IMEC 19 Aug 2010

Imec's Tandem Organic Solar Cells Offer Path to Higher Efficiencies

Imec has fabricated tandem organic solar cells with peak conversion efficiencies of 5.15%. This was achieved by stacking two different planar heterojunction devices, each with a high open-circuit voltage (Voc).

From IMEC 19 Aug 2010

New ioMemory Module from Fusion-io Supports 3X-nm MLC NAND Flash

Flash Memory Summit 2010 – Fusion-io, the pioneer of a new tier of flash-based memory (ioMemory), today announced the availability of its new ioMemory module. With support for the latest generation of MLC NAND F...

19 Aug 2010

Stretching of Europium Titanate Thin Films Result in Ferromagnetic Ferroelectric Material

It's the Clark Kent of oxide compounds, and – on its own – it is pretty boring. But slice europium titanate nanometers thin and physically stretch it, and then it takes on super hero-like properties that ...

19 Aug 2010

Breakthrough Paves Way to Store and Process Information in Novel Spin-Electronics

Processing large amounts of information in today's electronics requires large amounts of power, which results in heating. Heat can ruin modern electronics by potentially damaging the stuff that makes them work--the ever smaller and denser structures in a computer's "brain," the microprocessor that incorporates all of its logic functions.

18 Aug 2010