Nanoelectronics News

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New Approach in the Design of Miniature Insectlike Microids

Advanced computer simulations indicate these synthetic bugs would have significantly better dexterity than previous microscale robots. The robots also might be able to "scavenge vibrational energy" from the environment to recharge their power supply, said Jason Clark, an assistant professor of electrical, computer and mechanical engineering at Purdue University.

27 Jan 2010

Bizarre Substance Predicted to Shrink Electronics

A bizarre substance predicted to shrink electronics and give quantum physicists a new tabletop toy behaves pretty much as its designers expected.

27 Jan 2010

Power-Generating Rubber Films Harnessing Natural Body Movements to Power Electronic Devices

Power-generating rubber films developed by Princeton University engineers could harness natural body movements such as breathing and walking to power pacemakers, mobile phones and other electronic devices.

27 Jan 2010

Validated Flow for Rapid Reduction in Variation Risk in Nanometer Designs at Transistor Level

Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), and Solido Design Automation, provider of Variation Designer, today announced a validated fl...

26 Jan 2010

Mismatched Alloys A Good Match for Future Development of High Performance Thermoelectric Devices

Employing some of the world's most powerful supercomputers, scientists at Lawrence Berkeley National Laboratory have shown that mismatched alloys are a good match for the future development of high performance thermoelectric devices.

From Lawrence Berkeley National Laboratory 26 Jan 2010

sp3 Diamond Technologies Announces Availability of New Turnkey Metalized Diamond Heat Spreading Segments

sp3 Diamond Technologies, Inc. (sp3), a leading supplier of diamond products, equipment and services, and Stellar Industries Corp. (Stellar), specializing in thermal management materials and metallization, today announce...

From sp3 26 Jan 2010

NEC Adopts Cadence EDI System for Leading-Edge 40-nm ASIC Designs

Cadence Design Systems and NEC Electronics Corporation, today announced that NEC Electronics has adopted Cadence Encounter Digital Implementation (EDI) System and succeeded in more than ten complex ASIC designs targeting its CB40L (40 nanometer low power) process technology with several designs successfully taped out already.

From Cadence Design Systems 26 Jan 2010

Nanoelectronics News

New Approach in the Design of Miniature Insectlike Microids

Bizarre Substance Predicted to Shrink Electronics

Power-Generating Rubber Films Harnessing Natural Body Movements to Power Electronic Devices

Validated Flow for Rapid Reduction in Variation Risk in Nanometer Designs at Transistor Level

Mismatched Alloys A Good Match for Future Development of High Performance Thermoelectric Devices

sp3 Diamond Technologies Announces Availability of New Turnkey Metalized Diamond Heat Spreading Segments

NEC Adopts Cadence EDI System for Leading-Edge 40-nm ASIC Designs

HDMI PHY IP Available in More than 10 Processes from 90-nm to 40-nm

First Global Study: Gold Wire vs. Copper Wire

Camtek Introduces New Semiconductor Inspection Tool Focused on Special Requirements of LED Market

Sustainable Carbon Nanomaterial Gii Set to Transform Energy Storage in Internet of Things Devices

Sustainable Future for Carbon Nanotubes

Sustainable ZnO Nanoparticles for Methylene Blue Cleanup

Modeling the Growth of Hexagonal Boron Nitride for Next-Generation Applications

Enhancing Material Properties through Nanotube Encapsulation

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Conversations on AFM: Applications of BioAFM in Life Science

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials