Nanoelectronics News

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Companies Scrambling to Find Unconventional Ways to Increase Revenue and Maximize Assets

29 Jul 2009
Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

29 Jul 2009

Improved Modeling Enables Encounter Digital Implementation System to Accelerate Advanced Node Design

From Cadence Design Systems 29 Jul 2009

Strasbaugh Receives Order for nFinity Prime Wafer Polishers

29 Jul 2009

Virage Logic Extends Advanced IP Technology Leadership to the 32/28-Nanometer Process Node

29 Jul 2009
First-Time Tegal Customer Orders Third-Generation ICP Source for 200mm DRIE Applications

First-Time Tegal Customer Orders Third-Generation ICP Source for 200mm DRIE Applications

From Collabrx, Inc. 29 Jul 2009

Third-Generation ICP Source Improves DRIE Productivity and Yield for MEMs And 3d IC Market Applications

From Collabrx, Inc. 29 Jul 2009

GLOBALFOUNDRIES Secures Industry Leader as First Customer for Leading-Edge, Low-Power Bulk Silicon Technology

From GlobalFoundries 29 Jul 2009

Flexible Pin Configuration Supports Diverse DRAMs and Improves Throughput

28 Jul 2009
Vacuum Laminated Dry Films for 3D TSVs Flow Into Vias for Void Free, Planarized Coverage

Vacuum Laminated Dry Films for 3D TSVs Flow Into Vias for Void Free, Planarized Coverage

28 Jul 2009

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