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Silicon-Proven Reference Design Approach Accelerates RF Designs and Enables Systems-on-Chip Integration

AIXTRON Receives Order for Black Magic PECVD for Carbon Nanotube Growth from GaTech

AIXTRON Receives Order for Black Magic PECVD for Carbon Nanotube Growth from GaTech

Rudolph Technologies Joins SEMATECH's 3D Interconnect Program at UAlbany NanoCollege

Rudolph Technologies Joins SEMATECH's 3D Interconnect Program at UAlbany NanoCollege

IMEC Successfully Transferred MemoryVAM to Samsung Electronics

IMEC Successfully Transferred MemoryVAM to Samsung Electronics

Design Strategy Paving Way to Multi-Electrode Deep-Brain Stimulation

Design Strategy Paving Way to Multi-Electrode Deep-Brain Stimulation

Sokudo Launches Breakthrough SOKUDO DUO Platform

Sokudo Launches Breakthrough SOKUDO DUO Platform

New Kind of Reconfigurable Chip that is Both Efficient and Flexible

New Kind of Reconfigurable Chip that is Both Efficient and Flexible

Joint Development Research Focuses on 3D TSV Process Control

Chinese Manufacturer Uses Veeco's MOCVD Systems for High Volume Production of HB-LEDs

Chinese Manufacturer Uses Veeco's MOCVD Systems for High Volume Production of HB-LEDs

Researchers Found Way to Make Transistors Smaller and Faster Using Self-Assembled Nanowires

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