Nanoelectronics News

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KLA-Tencor Acquires MIE Business Unit of Vistec Semiconductor Systems

KLA-Tencor today announced that it has entered into an agreement to acquire the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems, which is wholly owned by Golden Gate Capital, a Sa...

From Vistec Electron Beam 31 Jul 2008

PI Releases Comprehensive Reference Book on Nanopositioning Technology

A comprehensive reference book on nanopositioning technology entitled "Piezo Stages, Nanopositioning Systems, Ultra-Precision Actuators + Motors" is available in PDF format from PI.

31 Jul 2008

Carbon Nanoprobes Receives Custom Orders from Leading Semiconductor Manufacturers

Carbon Nanoprobes, Inc., an emerging nanotech solutions provider, welcomes its first revenue from two major semiconductor manufacturers. Contracts with major semiconductor companies are a huge milestone for CN Probes.

30 Jul 2008

XACTIX and STS Created Module with Breakthrough Chamber Design and Improved Wafer Handling

Surface Technology Systems and XACTIX are pleased to announce the immediate availability of a new Chemical Vapor Etch (CVE) module for xenon difluoride (XeF2) gas. XACTIX and STS have cooperated to create a breakthrough ...

30 Jul 2008

A Novel Way to Kill Tumor Cells Using Nanoparticles and Light

Medical physicists at the University of Virginia have created a novel way to kill tumor cells using nanoparticles and light. The technique, devised by Wensha Yang, an instructor in radiation oncology at the University of...

30 Jul 2008

Scientists Created 3-D Images of Nanofoam to Determine its Strength and Potential Applications

Researchers have created a 3D image of a material referred to as "liquid smoke." Aerogel, also known as liquid smoke or "San Francisco fog," is an open-cell polymer with pores smaller than 50 nanometers in diameter.

30 Jul 2008

Ultratech's AP300 Lithography Systems Enable Capacity Expansion of Customer's Facility in Asia

Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced it received multiple orders from one of the largest memory manufacturers in the w...

30 Jul 2008

3D-TSV Wafers Account for More Than 6% of Total Semiconductor Industry by 2015

Research and Markets has announced the addition of the "3-D TSV Interconnects - Equipment + Materials 2008 Report" report to their offering. The Next Revolution for Semiconductor Packaging & Circuit Ass...

From Research and Markets 30 Jul 2008

Opportunities for Nanocrystalline Silicon and Silicon Inks in Electronics

As printed electronics emerges as a force to be reckoned with, its future will be dependent on high-performance semiconductor inks. At present, most of the focus is on organic inks but these present serious mobility, sta...

30 Jul 2008

Pillar Bump and OptoCooler Module Receives Awards from Two Leading Technology Magazines

Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, continues to receive industry accolades for its technology innovation excellence.

29 Jul 2008