Nanoelectronics News

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Transparent, Electrically Conductive Silver Nanowires as Electrode for Optoelectronics

A team of researchers headed by Prof. Silke Christiansen from the Institute of Nanoarchitectures for Energy Conversion at Helmholtz-Zentrum Berlin (HZB) has created a novel transparent electrode capable of high electrical conductivity for solar cells and other optoelectronic components with limited material. The electrode is made up of an irregular network of silver nanowires coated with aluminium-doped zinc oxide.

3 Aug 2015

Graphene-Boron Nitride Nanotube Hybrid Switches Could Revolutionize the World of Electronics

A team of researchers headed by Yoke Khin Yap, a Professor of Physics at Michigan Technological University, has worked to create digital switches by integrating graphene and boron nitride nanotubes.

3 Aug 2015

Veeco Announces Shipment of 50th TurboDisc EPIK700 GaN MOCVD System Reactor

Veeco Instruments Inc. announced today that it has shipped the 50th TurboDisc® EPIK™700 GaN Metal Organic Chemical Vapor Deposition (MOCVD) System reactor since its introduction ten months ago.

From Veeco 31 Jul 2015

Synopsys DesignWare IP on TSMC 16-nm FinFET Plus Process Achieves Certification from Multiple Standard Organizations

Synopsys, Inc., today announced that it has achieved certification and compliance from multiple standard organizations for a broad range of DesignWare® IP on the TSMC 16-nm FinFET Plus (16FF+) process including USB 2.0 and USB 3.0, PCI Express® 3.1, HDMI 2.0, MIPI® D-PHYSM and Serial ATA (SATA™) IP solutions.

30 Jul 2015

Tanaka Precious Metals Launches RAD-Plater, Cup-Type, Ultra-Compact Plating Laboratory Equipment for Semiconductor Wafers

Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals’ plating business, has developed, and launched from July 15, the RAD-Plater cup-type1 ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.

28 Jul 2015

New Report on Barrier Layers for Flexible Electronics

Research and Markets has announced the addition of the "Barrier Layers for Flexible Electronics 2015-2025: Technologies, Markets, Forecasts" report to their offering.

27 Jul 2015

Department of Defense Honors Pitt’s Reconfigurable Nanoelectronics Pioneer as NSSEFF Fellow

The U.S. Department of Defense recently selected University of Pittsburgh professor Jeremy Levy as one of seven distinguished university faculty scientists and engineers forming the next new class of National Security Science and Engineering Faculty Fellows (NSSEFF).

24 Jul 2015

Carbon Ion Implantation Technique Allows Direct Synthesis of Wafer-Scale Graphene in Silicon Microelectronics

A team of researchers from Korea University, Seoul, has developed an easy and scalable technique for growing graphene, and have synthetically produced high-quality, multi-layer, wafer-scale graphene on silicon substrates. This latest breakthrough paves the way for using graphene in silicon microelectronics on a commercial scale.

23 Jul 2015

Renesas Electronics Debuts Two New Series of Advanced Low Power SRAM Fabricated Using 110nm Process

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the release of two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid.

23 Jul 2015

ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

ProPlus Design Solutions, Inc. today announced that eSilicon Corporation, a leading independent semiconductor design and manufacturing solutions provider, has selected its high-performance parallel SPICE simulator and its variation analysis platform for advanced intellectual property (IP) designs at 28-nanometer (nm), 16nm and beyond.

22 Jul 2015

Nanoelectronics News

Transparent, Electrically Conductive Silver Nanowires as Electrode for Optoelectronics

Graphene-Boron Nitride Nanotube Hybrid Switches Could Revolutionize the World of Electronics

Veeco Announces Shipment of 50th TurboDisc EPIK700 GaN MOCVD System Reactor

Synopsys DesignWare IP on TSMC 16-nm FinFET Plus Process Achieves Certification from Multiple Standard Organizations

Tanaka Precious Metals Launches RAD-Plater, Cup-Type, Ultra-Compact Plating Laboratory Equipment for Semiconductor Wafers

New Report on Barrier Layers for Flexible Electronics

Department of Defense Honors Pitt’s Reconfigurable Nanoelectronics Pioneer as NSSEFF Fellow

Carbon Ion Implantation Technique Allows Direct Synthesis of Wafer-Scale Graphene in Silicon Microelectronics

Renesas Electronics Debuts Two New Series of Advanced Low Power SRAM Fabricated Using 110nm Process

ProPlus Design Solutions’ SPICE Simulator Selected by eSilicon for 28/16nm IP Designs

Harnessing Biology for Sustainable Energy Production

Calcium Carbonate Nanoparticles: Boosting T Cell Activation in Cancer Therapy

Low-Temperature Synthesis of Ultrathin Two-Dimensional Materials via BiOCl-Assisted CVD

Novel Method for Producing Superior Carbon Nanofibers via Additive Nanostructuring

New Approach to Functionalizing Graphene for Electronic Applications

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials