Research and Markets has announced the addition of the "Printed, Organic & Flexible Electronics Forecasts, Players & Opportunities 2015-2025" report to their offering.
PLDA, the industry leader in PCI Express® IP solutions has added Analog Bits, the semiconductor industry’s leading provider of mixed-signal IP, to its ecosystem of PHY partners. Together, the partners have developed a silicon-proven PCIe Gen 3 solution for a leading 28nm low-power process node that offers ASIC engineers great power savings and improved performance.
A European research project has made an important step towards the further miniaturisation of nanoelectronics, using a highly-promising new material called silicene. Its goal: to make devices of the future vastly more powerful and energy efficient.
Cadence Design Systems, Inc., today announced that Brite Semiconductor Corporation, used Cadence® digital implementation and signoff tools to complete four 28nm system-on-chip (SoC) designs and reduced their time to market by three weeks compared to previous design methodologies. By using Cadence tools, Brite Semiconductor was also able to increase performance by up to 20 percent and reduce power consumption by up to 10 percent on these designs.
Today, at the 2015 International Solid State Circuits Conference (ISSCC), nanoelectronics research center imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceiver, paving the way to cost-effective, high-density single-mode optical fiber links.
Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced that it has developed a new low-power 2.5 GHz RF transceiver technology that is compatible with the Bluetooth® Low Energy (BLE) standard, and will be the core technology for short-distance wireless communication in wearable devices and other elements of the Internet of Things (IoT).
Altera Corporation today strengthened its leadership position in SoC FPGA products by shipping its second-generation SoC family. Arria® 10 SoCs are the industry's only programmable devices that combine ARM® processors with a 20 nm FPGA fabric. Arria 10 SoCs bring across-the-board improvements to enable higher performing, lower power, and more feature rich embedded systems compared to previous generation SoC FPGAs.
Xilinx, Inc. today announced its 16nm UltraScale+™ family of FPGAs, 3D ICs, and MPSoCs, combining new memory, 3D-on-3D and multi-processing SoC (MPSoC) technologies, delivering a generation ahead of value. In addition, to enable an even higher level of performance and integration, the UltraScale+ family also includes a new interconnect optimization technology, SmartConnect. These devices extend Xilinx's UltraScale portfolio – now spanning 20nm and 16nm FPGA, SoC, and 3D IC devices – and leverage a significant boost in performance/watt from TSMC's 16FF+ FinFET 3D transistors.
It’s nearly 50 years since Gordon Moore predicted that the density of transistors on an integrated circuit would double every two years. “Moore’s Law” has turned out to be a self-fulfilling prophecy that technologists pushed to meet, but to continue into the future, engineers will have to make radical changes to the structure or composition of circuits. One potential way to achieve this is to develop devices based on single-molecule connections.
The Advanced Materials group of Materion Corporation has been honored with the “2014 Annual Perfect Quality Award” by ISMF, the Malaysian manufacturing plant of ON Semiconductor (NASDAQ: ONNN). The award recognizes Materion for achieving a “perfect” rating for quality control and for the highest performance among eight materials suppliers.
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