Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has received multiple orders for its NSX® and WaferScanner™ Inspection Systems from STATS ChipPAC Ltd. The systems will be used for high-throughput inspection during each step of the eWLB (embedded wafer-level ball grid array) process. Shipments commenced in 4Q09 and will continue through 1Q10.
“Rudolph offers thin wafer handling options for both the flagship NSX 2D wafer inspection system and the industry-standard WS3840 3D bump inspection system. These handling options are designed to accommodate production level throughputs, hence minimizing the cost of ownership for these tools.”
The eWLB manufacturing process, often referred to as fan-out wafer level packaging, is an emerging packaging technology driven primarily by the wireless market. The IC packages are thinner and smaller with higher I/O, which tend to be lower in cost, higher performance, and more power efficient than many of the existing packaging solutions.
“STATS ChipPAC has been ramping production capacity in Singapore to support the strong demand we are seeing for eWLB. We have established an efficient, cost effective manufacturing process to ensure eWLB is competitive with other packaging solutions available in the market. The Rudolph inspection systems are essential to our manufacturing process,” said Harry Kam, eWLB director, STATS ChipPAC.
“The eWLB process is one of the hottest topics in advanced packaging today, and we are just starting to see the first commercial adoption of this new packaging technology for mobile phone applications,” said Rajiv Roy, Rudolph’s vice president of business development and director of back-end marketing. “Rudolph inspection systems are used during many steps in the redistribution and back-end processes,” he said.
“The reconstitution step coupled with back-grinding introduces special handling challenges because the wafers can warp,” Roy stated. “Rudolph offers thin wafer handling options for both the flagship NSX 2D wafer inspection system and the industry-standard WS3840 3D bump inspection system. These handling options are designed to accommodate production level throughputs, hence minimizing the cost of ownership for these tools.”
Rudolph offers a complete line of inspection and metrology systems for semiconductor manufacturing applications. The NSX 115 automated inspection tool is optimized specifically for the back-end manufacturing environment, and offers high throughput and extensive flexibility in the detection and analysis of macro defects created during wafer manufacturing, probing, bumping, dicing, or by general handling. The WaferScanner 3840 uses proprietary laser triangulation technology to provide fast and accurate 3D measurements of bump height and coplanarity. The open architecture and scalable system provided by Rudolph’s Discover® software on the NSX System can encompass all inspection tools on the fab floor. It is designed to efficiently analyze the tremendous volume of data generated by high-speed inspection tools to identify significant events, such as process excursions, and provide process engineers with the information required to optimize the manufacturing processes.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test, and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in ten countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com.
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. Rudolph offers yield management solutions used in wafer processing and final manufacturing through a family of systems for macro-defect inspection (detection and classification), as well as transparent and opaque thin film measurements.