Stanford University (Stanford, CA) is extending their research capability in the area of nanotechnology and photonics with the decision to purchase three Plasma-Therm dry etching systems. These new systems complement a previous facility upgrade when two Plasma-Therm deposition systems were ordered in February, 2010.
The latest systems, all configured as inductively coupled plasma (ICP) etchers, will add to Stanford's Nanofabrication Facility (SNF) infrastructure. The equipment selected will focus on high performance etching of silicon, metals, and dielectrics and are based on Plasma-Therm's leading product, the VERSALINE.
Sample loding into a Plasma Therma VersaLine dry etch system.
Plasma-Therm's fast process technology suite for deep silicon etching (DSE) and the strength of an award winning service organization were among the differentiating factors. The combination of etching and deposition tools will fulfill many of the processing needs for over 600 registered SNF users.
"Plasma-Therm's efforts to provide advanced plasma processing capabilities to organizations such as Stanford's Nanofabrication Facility, stems from our desire to partner with those on the innovative horizon," explained Dr. David Lishan, Principal Scientist and Director of Technical Marketing. "This new set of equipment provides SNF with both upgraded and new capabilities that will stimulate researchers' imaginations and play a role in scientific discovery.
For example, our VERSALINE DSE system delivers precise control needed for intricate SOI structures and exceptionally smooth feature sidewalls while maintaining the benefits of wide process windows. The many features are ideal for R&D and production environments."