Brewer Science and EV Group sign an agreement for the joint development and commercialization of the ZoneBOND technology for temporary wafer bonding. According to the agreement both parties will actively work towards making the ZoneBOND technology commercially available for the customers of the temporary wafer bonding market.
Thin Wafer
The ZoneBOND technology is an innovative approach in the area of temporary wafer bonding, debonding and thin wafer processing. This method is an enhancement of thin wafer processing and overcomes the limitations faced with that method.
The ZoneBOND technique makes use of silicon, glass and other carriers for processing and is compliant with the other existing adhesive platforms. The ZoneBOND technology also allows debonding at room temperature itself without the need of any application of vertical forces on the wafer. The ZoneBOND technique sets aside two separate zones for grinding and backside processing at high temperatures and one for low-force carrier separation. These two zones are defined on the wafer surface with a strong bonding in the perimeter and least binding in the center. As a result of this zone formation, a low separation force is sufficient for the carrier separation after the removal of the polymeric edge adhesive by means of solvent dissolution or any other technique.
According to CEO, Founder and President of Brewer Science, the company is extremely pleased on being able to introduce the ZoneBond temporary debonding and bonding technology in the market.