SanDisk to Build iNAND Ultra Line Using 19 nm Production Technology

SanDisk has declared that its iNAND Ultra series of products will be built on its 19 nm production process. The iNAND Ultra series is the first of the company’s portfolio of flash memory products to be developed using the sophisticated production technology in 2012.

SanDisk's iNAND Ultra embedded flash memory products utilize 19nm manufacturing technology. (Photo: Business Wire)

The iNAND product portfolio of SanDisk comprises iNAND, iNAND Extreme and iNAND Ultra products. It provides embedded storage solutions for each capacity point and performance segment in the mobile market.

The e.MMC devices to be produced on SanDisk’s 19 nm production process will utilize its two-bit per cell technology. The company’s pioneering packaging technology, which offers up to a storage capacity of 64 GB in an 11.5 x 13 mm package, allows thin form factor designs. The company can provide some capacities in packages down to 1 mm thanks to its sophisticated packaging technologies.

The iNAND ultra line of products is designed for existing and upcoming generations of major mobile operating systems, including Windows Mobile and Google Android. This optimized hardware design for major operating systems together with remarkable dynamic performance features will enable the development of mobile devices with superior multitasking and browsing features.

The new products have a sequential reading capability of 80 MB/s and a sequential writing capability of 20 MB/s for rapid file transfers. Moreover, SanDisk together with prominent chipset vendors and OEMs focuses on ensuring the close integration needed between the embedded flash memory and host devices, which results in the widespread integration of the company’s embedded memory technology into major mobile reference designs and in the improvement of experience of mobile users.

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