UltraSource, a supplier of thin film circuits and ceramic interconnect devices, is set to unveil its new CopperVia™ process at the 2012 IEEE MTT-S International Microwave Symposium to be held at Montreal, Canada, between June 19 and June 22.
Top View of an UltraSource CopperVia Circuit
The company's patented UltraVia process forms the basis of the new CopperVia™ process. CopperVia™ eliminates solder or epoxy bleed-through, and provides an economical and reliable electrical and thermal path with maximized electrical and thermal conductivity in thin film circuits.
The new process empowers UltraSource's current suite of solutions to meet the design challenges posed by 2.5-D, 3-D and multi-layer thin film circuits. Ceramic substrates require high degree of electrical and thermal performance when employed in RF, DC and microwave circuits with electronic interconnects and interposers. The solid copper tracks offer a microwave grounding path with low inductance and enable RF circuits to be surface mounted to provide the maximum thermal efficiency. CopperVia™ lowers cost by eliminating the need for precious metals for interconnection between the multiple layers of high frequency circuits. It also meets the reliability requirements amid rough environment conditions prevalent in applications such as defense, infrared detection, medical systems and fiber optic transceivers.