Research and Markets has announced the addition of the "3D Transistor Trends" report to their offering.
The report projects that 3D Transistors is set to become the norm as a 3D transistor is an advanced transistor that is manufactured by using nano wires in comparison to traditional usage of silicon. The development of 3D Transistors is likely to change the dynamics of semiconductor manufacturing industry.
The manufacturing process of 3D transistors involves a top-down method, wherein components of the transistor are etched on the transistor's base. The nano wires, made of iridium, gallium as well as arsenide semiconductors, are layered with a thinner dielectric made of lanthanum aluminate for performing the gate operation efficiently with reduced voltage requirements.
Key Topics Covered:
1. 3D TRANSISTORS - AN OVERVIEW
- Transistors - An Introduction
- 3D Transistors - The Next-Generation Transistors
- 3D Transistors Vs. 2D Transistors
- 3D Transistors - Advantages
- Future Developments
- 3D Chips - Applying 3D Transistors to Improve Performance of Future Electronic Devices
- Stacking Techniques
- 3D Chips-Major Challenges to Overcome
- Recent 3D Chip-based Developmental Activities
- TSMC to Challenge Intel's Leadership in Advanced Semiconductor Manufacturing Technology
2. END-USE APPLICATIONS
- 3D-Enabled Smartphones
- Media Tablets
- Ultrabooks
- Netbooks
3. RECENT INDUSTRY ACTIVITY
- Altera and Intel Enter into Partnership
- Synopsys and Samsung Announce Tapeout of First 14-nanometer FinFET-based Test Chip
- TSMC Partners with ASML
- United Microelectronics and IBM Technology Ink Agreement
- Soitec and SEMATECH Enter into Partnership
4. PRODUCT LAUNCHES/INNOVATIONS
- IEMN and LAAS-CNRS Develop 3D Nanometric Transistor
- Synopsys Unveils Comprehensive Solution of EDA IP and Tools
- Intel Unveils Range of Quad-Core 3rd Generation Processors
- Globalfoundries Unveils 14-nanometer eXtreme Mobility Process
- Intel Unveils Xeon Server Processors
- Intel Introduces Tri-Gate 3D Transistor
- Intel Unveils Silvermont Atom Chip Architecture
5. MARKET PARTICIPANTS
- Globalfoundries, Inc. (USA)
- Intel Corporation (USA)
- Laboratoire D'analyse ET D'architecture Des Systèmes (LAAS- CNRS) (France)
- National Institute of Advanced Industrial Science and Technology (AIST) (Japan)
- Samsung Semiconductor, Inc. (USA)
- Soitec SA (France)
- Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) (Taiwan)
- Unisantis Electronics (Japan) Ltd. (Japan)
6. APPENDIX
For more information visit http://www.researchandmarkets.com/research/2sh7dk/3d_transistor