ProPlus NanoSpice Giga SPICE Simulator for Design Characterization Adopted by Dolphin Technology

ProPlus Design Solutions, Inc. today announced Dolphin Technology has adopted NanoSpice™ Giga, a high performance, giga-scale capacity SPICE simulator, for use with 28- and 16-nanometer (nm) design characterization and verification.

NanoSpice Giga has been implemented into Dolphin Technology's design flow and used for both 28nm and 16nm FinFET product designs, and has run large post-layout cases with more than 120-million elements. According to Dolphin Technology, a leading provider of high-performance Semiconductor Intellectual Property (IP), NanoSpice Giga efficiently handles cases like this with a pure SPICE engine that delivers outstanding performance.

Dolphin Technology selected NanoSpice Giga for its ability to handle large-scale designs with a pure SPICE engine that eliminated the concern for inaccuracy. Additionally, Dolphin Technology, after an extensive evaluation of numerous simulator options, determined NanoSpice Giga was easy to use and required no complicated option settings and tuning.

"ProPlus and NanoSpice Giga surpassed our expectations," notes Mo Tamjidi, chief executive officer (CEO) of Dolphin Technology. "Our designs are large and complex, and moving to advanced nodes like 16nm FinFET requires high simulation accuracy. We need a tool such as NanoSpice Giga to efficiently and accurately characterize and verify them."

In addition, ProPlus, the leading technology provider of giga-scale parallel SPICE simulation, SPICE modeling solutions and Design-for-Yield (DFY) applications, and Dolphin Technology have established a long-term alliance to further boost NanoSpice's performance and capacity for faster simulation and larger circuits, such as NanoSpice Giga's ability to handle more than one-billion elements.

"Dolphin Technology pushed the boundaries with NanoSpice Giga to ensure accuracy, reliability and high performance for design characterization and verification," says Dr. Zhihong Liu, executive chairman and CEO of ProPlus Design Solutions. "With NanoSpice Giga's billion-element capacity and fast performance, designers now have new options when selecting a SPICE simulator. We're delighted to have an opportunity to team up with a leading-edge engineering organization like Dolphin Technology."

ProPlus at DAC

ProPlus will demonstrate NanoSpice Giga and its FinFET-ready DFY products for nano-scale SPICE modeling and giga-scale SPICE simulation at the 51st Design Automation Conference (DAC) in Booth #905. DAC will be held Monday, June 2, through Wednesday, June 4, from 9 a.m. until 6 p.m. at the Moscone Center in San Francisco. To schedule a meeting or demonstration, send email to: [email protected].

More information about DAC is available at: www.dac.com.

About ProPlus Design Solutions

ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA) solutions with the mission to enhance the link between design and manufacturing. It is the global leader for SPICE modeling solutions and the leading technology provider for unique Design-for-Yield (DFY) products that integrate the key DFY components --advanced device modeling software, a parallel SPICE simulation circuit simulator and hardware-validated statistical variation analysis tools. Products include: BSIMProPlus™/Model Explorer™, a modeling technology platform for nanometer devices; NoisePro™/9812B/9812D, the golden solution for low-frequency 1/f noise and Random Telegraph Signal (RTS) noise characterization and process monitoring; NanoSpice™, a high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation; and NanoYield™/NanoExplorer™, a variation analysis platform for yield versus power, performance and area trade-off of memory, analog and digital circuit designs. ProPlus Design Solutions has R&D centers in the San Jose, Calif. and Beijing and Jinan, China, with sales offices in Tokyo, Japan, Hsinchu, Taiwan, and Shanghai, China. More information about ProPlus Design Solutions can be found at www.proplussolutions.com.

BSIMProPlus, Model Explorer, NanoExplorer, NanoSpice, NanoYield and NoisePro are registered trademarks of ProPlus Design Solutions. ProPlus Design Solutions acknowledges trademarks or registered trademarks of other organizations for their respective products and services.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    ProPlus Design Solutions, Inc.. (2019, February 11). ProPlus NanoSpice Giga SPICE Simulator for Design Characterization Adopted by Dolphin Technology. AZoNano. Retrieved on November 23, 2024 from https://www.azonano.com/news.aspx?newsID=30227.

  • MLA

    ProPlus Design Solutions, Inc.. "ProPlus NanoSpice Giga SPICE Simulator for Design Characterization Adopted by Dolphin Technology". AZoNano. 23 November 2024. <https://www.azonano.com/news.aspx?newsID=30227>.

  • Chicago

    ProPlus Design Solutions, Inc.. "ProPlus NanoSpice Giga SPICE Simulator for Design Characterization Adopted by Dolphin Technology". AZoNano. https://www.azonano.com/news.aspx?newsID=30227. (accessed November 23, 2024).

  • Harvard

    ProPlus Design Solutions, Inc.. 2019. ProPlus NanoSpice Giga SPICE Simulator for Design Characterization Adopted by Dolphin Technology. AZoNano, viewed 23 November 2024, https://www.azonano.com/news.aspx?newsID=30227.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.