Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing

Applied Materials, Inc. today unveiled the Applied Olympia(TM) ALD system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips. The 3D device inflection is driving growth in ALD with demand for new patterning films, new conformal materials and lower thermal budgets.

The Olympia system is well positioned to fulfill these requirements with uncompromising ALD performance, addressing industry needs with the process flexibility to precisely engineer and efficiently deposit a variety of low-temperature, high-quality films for multiple applications.

"Our Olympia system is a major technology innovation for the 3D device inflection," said Dr. Mukund Srinivasan, vice president and general manager of Applied's Dielectric Systems and Modules group. "The Olympia system overcomes fundamental limitations chipmakers are experiencing with conventional ALD technologies, such as reduced chemistry control of single-wafer solutions and long cycle times of furnaces. Because of this, we're seeing strong market response with Olympia systems installed at multiple customers to support their move to 10nm and beyond."

The Olympia system's adaptable modular architecture enables a uniquely flexible and rapid process sequence vital for controlling the more complex chemistries needed to develop the next generation of ALD films. Further, the modular design creates complete separation of chemistries, eliminating the pump/purge steps of conventional ALD technologies for improved productivity. The combined advantages of the Olympia system offer a superior solution to conventional ALD systems and position the tool for widespread adoption.

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com.

*ALD=atomic layer deposition

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Applied Materials Inc.. (2019, February 11). Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing. AZoNano. Retrieved on November 21, 2024 from https://www.azonano.com/news.aspx?newsID=33265.

  • MLA

    Applied Materials Inc.. "Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing". AZoNano. 21 November 2024. <https://www.azonano.com/news.aspx?newsID=33265>.

  • Chicago

    Applied Materials Inc.. "Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing". AZoNano. https://www.azonano.com/news.aspx?newsID=33265. (accessed November 21, 2024).

  • Harvard

    Applied Materials Inc.. 2019. Applied Materials Debuts High-Performance ALD System for 3D Memory and Logic Chips Manufacturing. AZoNano, viewed 21 November 2024, https://www.azonano.com/news.aspx?newsID=33265.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.