AMKOR and IMEC Sign Collaboration Agreement for 3D Wafer-Level Packaging

Amkor Technology, Inc., a world-leading provider of advanced semiconductor assembly and test services, and IMEC, a leading independent non-profit nanoelectronics and nanotechnology research center based in Belgium, today announced that they have entered into a 2-year collaboration agreement to develop cost-effective, 3D integration technology based on wafer-level processing techniques.

"This collaboration with IMEC will enhance our continuing efforts to develop low cost, state of the art packaging solutions for our customers", said Dan Mis, Amkor’s Senior Vice President for Wafer Level Advanced Product Development.

Luc Van den hove, IMEC’s Executive Vice President and Chief Operating Officer, commented "We are pleased that one of the leading semiconductor packaging service providers has joined our 3D system integration program that targets the development of post-passivation technology for 3D interconnects at the IC bond pad level."