Aug 27 2008
SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry, announces the CB Series, semi and fully automated wafer bonders, for Advanced MEMS devices for the automotive and consumer markets.
There are a variety of wafer level bonding methods for MEMS fabrication processes like anodic and glass frit, with the most commonly used in Advanced MEMS being eutectic, fusion, and metal diffusion bonding.
The most challenging wafer level encapsulation and integration needs for MEMS are met by the newly released CB series wafer bonders designed for metal bonding applications that require high temperature and high force. CB technology features bond force to 90kN and temperatures to 600C along with precision temperature and pressure control for unrivaled process uniformity. These features enable significant die size and cost reduction for MEMS devices.
To meet the demanding alignment needs of advanced MEMS manufacturing SUSS MicroTec is releasing the BA200 Gen2, a high-precision alignment system, to complement the CB series.
For a smooth transition from the lab or low-volume production to full production recipes developed on the CB8, semi-automated wafer bonder, can easily be transferred to the CBC200, multi-chamber cluster tools.