Nov 5 2008
Tokyo Electron, Ltd. today unveiled the company's new 300mm Dicing Frame Prober, the WDF(TM) 12DP. Designed to address the increasing demand for probing of ultra thin and diced wafers, the system can also be used as a standard wafer prober.
TEL's WDF 12DP- Dual Purpose 300mm Dicing Frame Prober (Graphic: Business Wire)
Based on TEL's production-proven WDF DP system, the WDF 12DP also benefits from the advanced hardware reliability of TEL's 300mm Precio series of fully automatic wafer probers. Employing TEL's patented On-Axis Alignment and N-Shot alignment feature, the WDF 12DP provides superior accuracy and the ability to test in parallel.
The demand for ultra thin communication devices and ever-increasing feature density in those devices is driving innovation in packaging techniques, such as Chip Scale and Wafer-Level packaging, stacked and 3-D technologies. The WDF 12DP is designed to address the wafer-level testing of these packaging technologies, as well as Known Good Die testing of ultra thin wafers, singulated wafers and strips on a dicing frame.
"The introduction of a 300mm Dicing Frame prober adds another key element to TEL's line-up of production-proven wafer probing solutions," says Steve Nagasawa, VP and GM of TEL's Test System BU, "The WDF 12DP is ideally suited to address the advances in packaging and thin wafer technology being driven by the consumer market."