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  • News - 19 Feb 2007
    HIV may one day be able to be filtered from human blood saving the lives of millions of people, thanks to a world-first innovation by Queensland University of Technology scientists. QUT scientists...
  • News - 19 Feb 2007
    A newly designed porous membrane, so thin it's invisible edge-on, may revolutionize the way doctors and scientists manipulate objects as small as a molecule. The 50-atom thick filter can...
  • News - 19 Feb 2007
    Nuclear science and a host of other endeavors that involve the production, study and use of rare isotopes - is undergoing a quiet but dramatic revolution. That's the conclusion of Brad...
  • News - 14 Feb 2007
    The boom in Finnish nanotechnology is uncovered by the 'Nanotechnology in Finnish Industry' survey. The biannual survey studied the evolution of the Finnish nanotechnology scene in the period...
  • News - 6 Feb 2007
    A novel approach to synthesizing nanowires (NWs) allows their direct integration with microelectronic systems for the first time, as well as their ability to act as highly sensitive biomolecule...
  • News - 2 Jan 2025
    In a recent study published in the journal Nature, researchers from Columbia Engineering have developed new nanoscale force sensors. These sensors are luminescent nanocrystals that can change color...
  • News - 14 Oct 2024
    According to a study by MIT, new magnetic nanodiscs could offer a much less invasive way to stimulate specific brain regions. This advancement could lead to stimulation treatments that do not...
  • News - 22 Jan 2024
    Twelve years ago, Mickael Perrin began his scientific career with no idea that he would be working in the field of quantum electronics, which would only become popular a few years later. Mickael...
  • News - 12 Jan 2024
    Researchers at Columbia University and the US Department of Energy’s (DOE) Brookhaven National Laboratory have created a method for turning carbon dioxide (CO2) into carbon...
  • News - 11 Jan 2024
    Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter...

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