Dr. Cameron Chai

Acoustic Waves Make Nanowires Emit Light

A report recently published in Nano Letters, describes the work done by a team of NIM researchers led by Hubert Krenner and Achim Wixforth from the University of Augsburg and Gregor Koblmüller, Gerhard Abstreiter and Jonathan Finley from the Walter Schottky Institut at TU Munich.

External Magnetic Force Creates Bismuth Ferrite Nanostructures

A research team at the U.S. Department of Energy (DOE) Lawrence Berkeley Lab has increased natural magnetization in special versions of the multiferroic bismuth ferrite.

Conformal Plasma Doping for Three-Dimensional Transistors

The Applied Centura Conforma system recently launched by Applied Materials, features the Conformal Plasma Doping (CPD technology.

NanoPerspective Introduces Vendum Batteries to UK Market

Electronics’ Spin in Graphene Ideal for Transistor Application

Physicists at UCLA set out to design a better transistor and ended up discovering a new way to think about the structure of space.

Programmable Design Tools Created with 28 nm Technology

Xilinx has shipped the first of its 7 series FPGA Kintex-7 K325T Field Programmable Gate Array (FPGA), a programmable logic tool created with 28 nm technology.

Nanoparticles Coated with Ligand Shell to Develop Carbon Nanofibers

A research at North Carolina State University shows an enhanced system that will develop carbon nanofibers of particular dimensions.

Joint Venture to Develop Resin Wafer Technology

Nalco and the U.S. Department of Energy's (DOE) Argonne National Laboratory have inked a licensing contract for Argonne's resin wafer electrodeionization (RW-EDI) technology.

WaferSense Auto Gapping System to Help 300 mm fab Boost Accessibility of PECVD Tool

The Auto Gapping System from CyberOptics Semiconductors is a new edition of its legacy gapping technology that needed 10 hours to determine how far the chamber’s gas showerhead was from the wafer pedestal for consistent film deposition, especially with new dielectric films.

Endura Avenir Platform Increases 22nm Transistor Contacts

Applied Materials has recently added to the applications of its Applied Endura Avenir RF PVD platform to incorporate deposition of nickel-platinum (NiPt) alloys, to increase transistor contacts scaling to the 22nm technology node.