Dr. Cameron Chai

Molecular Nanometric Robot to Follow Commands to Change Track

The Engineering and Physical Sciences Research Council (EPSRC) has funded a research project by scientists who designed a programmable molecular robot that is a sub-microscopic molecular machine fabricated from artificial DNA that travels between spots on a track separated by 6nm.

Conference Highlights Integrated Bonding Tool for Mass Production

SEMATECH experts highlighted new developments in wafer bonding at the 7th Annual Device Packaging Conference (DPC) held between March 7 and 10 in Scottsdale, Arizona.

Ultrafast Laser Scribing Facilitates Using Solar Cells Efficiently and Cost-Effectively

A research team led by Yung Shin, a professor of mechanical engineering and director of Purdue University's Center for Laser-Based Manufacturing solar cells will become both cost and performance efficient with a production technique that uses an ultrafast pulsing laser.

Researchers Develop Instrument for Rapidly Analyzing Molecular Interactions

Researchers in Israel and California have designed an instrument to analyze molecular interactions occurring in viruses and the cells they infect.

Wash with a Base Removes Oxidative Debris from Graphene Oxide

A team of physicists led by Dr Jonathan P. Rourke, University of Warwick Chemist, and Dr Neil Wilson, has been researching on the properties of graphene oxide.

Nanostructured Metals to Enhance Efficiency of Engineering Applications

Chemical Reaction Overcomes Physical limits in High-Resolution Light Microscopy

Researchers working at Heidelberg University's Institute of Physical Chemistry and members of the Cluster of Excellence, CellNetworks have developed a method to replace light-dependent processes with chemical reactions to form cellular structures for high-resolution optical microscopy.

Albany NanoCollege Procures IBM Nanometer Technology

The University at Albany's College of Nanoscale Science and Engineering is procuring the new edition of the nanometer technology from IBM.

Interconnect Program at NanoCollege Addresses Infrastructure Issues

Hynix Semiconductor, a company developing Dynamic Random Access Memory chips (DRAMs) and flash memory chips, and SEMATECH recently declared that Hynix is now a member of SEMATECH’s three-dimensional Interconnect program at the College of Nanoscale Science and Engineering (CNSE) in the University at Albany.

Nanometrics Integrated Metrology Enhances Fab Build-Out

A semiconductor developer of Japan has recently acquired the IMPULSE integrated metrology (IM) solution from the California-based Nanometrics.