Dr. Cameron Chai

Articles from Cameron

Major Chip Manufacturer Places Order for ANTARES Single-Wafer Cleaning Systems

FSI International, a provider of surface conditioning technology, devices and support services for the production of microelectronics, has informed that it has received a follow-on order from a major device manufacturer for multiple ANTARES single-wafer cryokinetic cleaning systems.

8 Mar 2012

Northwestern University’s Nanocombinatorics Facilitates Stem Cell Differentiation

A research team led by Chad A. Mirkin from the Northwestern University has devised a powerful analytical technique called nanocombinatorics to rapidly detect the physical and chemical structures that can influence stem cells to turn into mature bone cells called osteocytes.

8 Mar 2012

mPhase Explores Advanced Materials for Printing Smart NanoBattery

mPhase Technologies has announced that it is investigating the use of graphene and other advanced materials for printing its Smart NanoBattery.

8 Mar 2012

Comprehensive Book on Corrosion Protection and Control Utilizing Nanomaterials

Research and Markets has included a new book titled ‘Corrosion Protection and Control Using Nanomaterials’ from Woodhead Publishing to its offering.

8 Mar 2012

EXFO Adds New MEMS Optical Switch Test Module to its IQS-600 Platform

EXFO has introduced its MEMS optical switch test module called the IQS-9100B, the latest addition to the company’s Windows-based IQS-600 platform.

8 Mar 2012

FlipChip International, NANIUM Ink Strategic Deal for 300 mm WLP and Bumping Services

FlipChip International, a specialist in wafer level packaging (WLP) and flip chip bumping, has inked license, sales and marketing deals with NANIUM, a provider of production, engineering and testing services in the semiconductor industry, for 300 mm WLP and flip chip bumping.

8 Mar 2012

STATS ChipPAC Unveils 3D eWLB Solutions at 2012 IMAPS Conference

STATS ChipPAC, a semiconductor solutions provider, has revealed the advanced 3D embedded Wafer Level Ball Grid Array Package-on-Package (PoP) technology solution.

8 Mar 2012

Research and Markets Adds Book on Microelectronics

Research and Markets has added a book titled "Understanding Microelectronics: A Top-Down Approach" to its offering. The author Franco Maloberti uses a top-down method to explain in detail the fundamentals of electronics.

8 Mar 2012

2012 Winter College on Nano-Optics and Plasmonics Conducted in Italy

Key topics of nano-optics and plasmonics and their applications in research, lasers and solar energy were discussed at the 2012 Winter College on Optics conducted from February 6 to 17, 2012, at the Abdus Salam International Centre for Theoretical Physics (ICTP) in Trieste.

7 Mar 2012

CALIENT Unveils 3D MEMS-Based High-Density Photonic Switch

CALIENT Technologies, a specialist in photonic switching technology, has introduced its new 320-port photonic switch called the S320, the company’s next-generation 3D MEMS switching technology.

7 Mar 2012