Nanolithography News

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Rudolph Technologies Receives Follow-On Order for Lithography and Inspection Systems

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications.

From Onto Innovation 28 Apr 2015

Applied Materials Introduces Centura Tetra Z Photomask Etch System for Quadruple Nanoscale Patterning

Applied Materials today announced the Applied Centura® Tetra(TM) Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple patterning scaling to the 10nm node and beyond. The new tool extends the capabilities of Applied's industry-leading Tetra platform, delivering angstrom-level photomask accuracy for critical dimension (CD) parameters required to meet stringent patterning specifications for future logic and memory devices.

21 Apr 2015

First-of-its-Kind 450mm Immersion Lithography Tool Installed at SUNY Poly's Albany NanoTech Campus

Governor Andrew M. Cuomo today announced the installation of the world’s first ever 450mm Immersion Scanner has begun at the SUNY Polytechnic Institute's Albany NanoTech Complex. Developed by Nikon Corporation, this first of its kind tool will accelerate the development of the next generation computer chips used in a variety of consumer and commercial applications.

16 Apr 2015

SEMICON Southeast Asia: Advantest to Highlight Nanotechnology Metrology and Lithography Tools

Experience the newest developments in semiconductor test solutions, nanotechnology products and terahertz systems by visiting leading semiconductor test equipment supplier Advantest Corporation's exhibit at SEMICON Southeast Asia. The exposition takes place April 22-24, 2015, at the SPICE Arena in Penang, Malaysia.

16 Apr 2015

Researchers Produce Nanowires Using Meniscus-Mask Lithography

Water is the key component in a Rice University process to reliably create patterns of metallic and semiconducting wires less than 10 nanometers wide.

8 Apr 2015

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through silicon via (TSV) processes used in the development of next-generation flip chip technology.

From Onto Innovation 12 Mar 2015

Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

Organic light emitting diodes (OLEDs), which are made from carbon-containing materials, have the potential to revolutionize future display technologies, making low-power displays so thin they'll wrap or fold around other structures, for instance.

3 Mar 2015

SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, has received a large order for various lithography tools from TDK in Q4 2014. Delivery and installation will take place already in the first quarter 2015.

From SUSS MicroTec AG 28 Feb 2015

SUNY Poly CNSE Recognized at SPIE Advanced Lithography 2015 for Pioneering Lithography Research

As a testament to Governor Andrew M. Cuomo’s high-tech blueprint for New York State, SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) announced that it is once again playing a major role at SPIE Advanced Lithography, a leading lithography-focused forum, with forty technical papers by SUNY Poly CNSE faculty, staff, and students and its corporate partners accepted for presentation.

From College of Nanoscale Science and Engineering, University at Albany 25 Feb 2015

Canon Announces Development of Next-Generation Nanoimprint Semiconductor Production System

Canon U.S.A. Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., is developing a next-generation semiconductor lithography system employing nanoimprint technology that makes possible sub-20 nm1 high-resolution processes.

24 Feb 2015

Nanolithography News

Rudolph Technologies Receives Follow-On Order for Lithography and Inspection Systems

Applied Materials Introduces Centura Tetra Z Photomask Etch System for Quadruple Nanoscale Patterning

First-of-its-Kind 450mm Immersion Lithography Tool Installed at SUNY Poly's Albany NanoTech Campus

SEMICON Southeast Asia: Advantest to Highlight Nanotechnology Metrology and Lithography Tools

Researchers Produce Nanowires Using Meniscus-Mask Lithography

Major OSAT Manufacturer Selects Rudolph JetStep® Advanced Packaging Lithography System for Evaluation

Confining Charge Transport and Recombination to Nanoscale Areas Increases Efficiency of OLEDs

SUSS MicroTec Receives Large Lithography Tools Order from TDK

SUNY Poly CNSE Recognized at SPIE Advanced Lithography 2015 for Pioneering Lithography Research

Canon Announces Development of Next-Generation Nanoimprint Semiconductor Production System

Researchers Develop a Stronger Alternative to Graphene

Boosting Hydrogen Fuel Production with TiO2 and Copper-Based MOFs

Oxalic Acid Triggers Gadolinium Nanoparticle Formation in Human Tissues

N-Doped Ti3O5: Enhanced Photocatalytic Removal of Phenolic Compounds from Wastewater

Breakthrough Nano Material Uses Sunlight to Tackle Pollution and Produce Energy

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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