Novati Technologies announced today the launch of its nanofabrication services and manufacturing site, featuring the world’s broadest portfolio of product-development capabilities and materials. The newly named company builds on 25 years of technology leadership cultivated from its roots at SEMATECH and, most recently, the SVTC fabrication foundry.
Scifiniti came out of stealth mode today, with the announcement of its first product, SmartWafer™. SmartWafer is an ultra-low cost, drop-in replacement photovoltaic (PV) silicon wafer that offers the same form factor and performance as traditional wafers, but costs less than half as much to produce.
STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced that it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).
The National Institute of Standards and Technology (NIST) has announced a competition to create an Advanced Materials Center of Excellence to foster interdisciplinary collaborations between NIST researchers and scientists and engineers from academia and industry.
Reportlinker.com announces that a new market research report is available in its catalogue: Bioinspired and Nanoengineered Surfaces: Technologies, Applications and Global Markets
An LMU research team led by Bert Nickel has, for the first time, succeeded in functionally characterizing the active layer in organic thin-film solar cells using laser light for localized excitation of the material. The findings are reported in the scientific journal “Advanced Materials”.
Entegris, Inc. and SEMI® are collaborating to organize a breakfast forum and panel discussion on achieving "Defect Reduction in the Sub-20 nm Era" for semiconductor manufacturing at the upcoming SEMICON West 2013 tradeshow. The forum will be held on Thursday, July 11, 2013 from 7:30 am to 10 am at the San Francisco Marriott Marquis in San Francisco, California.
Mattson Technology Inc., a leading supplier of advanced process equipment used for the manufacture of semiconductors, today announced that it has shipped multiple systems of its Helios® XP rapid thermal processing (RTP) system for use in mass production at a major foundry. The systems will support the foundry's 2Xnm capacity ramp by offering leading temperature control for reliable device manufacturing coupled with a low cost of ownership (CoO).
The smaller components become, the more difficult it is to create patterns in an economical and reproducible way, according to an interdisciplinary team of Penn State researchers who, using sound waves, can place nanowir...
The new generation system MeRiT® HR II from ZEISS offers a significantly higher degree of automation and increased flexibility in the repair of transparent and opaque defects. Any defect geometry on all known as well as new mask types and materials can be processed: Binary, OMOG, HD MoSi and EUV.
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