Nanofabrication News

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Cambridge NanoTech Delivers its 300th ALD Tool

Cambridge NanoTech has reached another milestone by delivering its 300th Atomic Layer Deposition (ALD) tool to the Chinese Academy of Sciences’ affiliate, the Institute of Coal Chemistry (ICC) located in Shanxi, China.

1 Mar 2012

Micro, Nano and MEMS Manufacturers Invited to Attend Event in Chicago Next Week

Rapid News Communications Group (RNCG) the organizers of MM Live, MEMS Live and NANO Live USA extend an open invitation to all parties working in the Micro, Nano and MEMS manufacturing arena to join them next week in Rosemont, IL.

27 Feb 2012

Research and Markets Offers Book on Self-Assembly and Nanotechnology Systems

Research and Markets has added a book titled ‘Self-Assembly and Nanotechnology Systems: Design, Characterization, and Applications’ to its catalogue.

From Research and Markets 23 Feb 2012

SUSS MicroTec to Combine Mask Aligner Tool with Software form GenISys

SUSS MicroTec a leading supplier of equipment and process solutions for the semiconductor industry and related markets and GenISys GmbH, provider of high-performance software solutions for nano scale fabrication, today a...

From SUSS MicroTec AG 21 Feb 2012

ALD-Grown Nano-Layer Increases Heat Transfer Rate of Solid Surfaces

A research team led by Bo Feng from the Georgia Institute of Technology has doubled the heat transfer rate of a metal surface by applying an alumina nano-coating over it.

17 Feb 2012

Strategic Business Report on Global Thin Layer Deposition Equipment Market

Research and Markets now offers a comprehensive report titled ‘Thin Layer Deposition Equipment - Global Strategic Business Report.’

From Research and Markets 17 Feb 2012

Tegal Continues Discussions to Sell Remaining Nano Layer Deposition Patent Portfolio

Tegal declared that it is currently in discussions to sell the fourth lot of its nano layer deposition patent portfolio pertaining to semiconductor processes.

From Collabrx, Inc. 16 Feb 2012

Imec Implements 300 mm Fab-Compatible DSA Process Line

At the SPIE Advanced Lithography conference to be conducted in San Jose, California, Imec will announce the successful deployment of first-of-its-kind 300 mm fab-compatible directed self-assembly (DSA) process line in its 300 mm cleanroom fab.

From IMEC 14 Feb 2012

CEA-Leti Reports Latest Achievements on MAPPER’s Lithography Solution

CEA-Leti has reported noteworthy advancements of the massively parallel direct write technology designed by MAPPER Lithography.

From CEA-Leti 14 Feb 2012

Development of Novel Tip Aids in Nanolithography and Nanomanufacturing Applications

A team of researchers at IBM Research – Zurich, the University of Wisconsin-Madison and the University of Pennsylvania has developed a nano-sized silicon carbide tip that has a wear resistance of 10,000 folds higher than that of the earlier designs, a major breakthrough in nanomanufacturing for applications such as biosensors for environment and healthcare monitoring.

From IBM Zurich Research Laboratory 10 Feb 2012