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Toshiba and SanDisk Inaugurate the Third Wafer NAND Fabrication Plant in Japan

Toshiba, along with SanDisk, opened the third 300,mm wafer NAND fabrication plant, known as Fab 5, at Toshiba's Yokkaichi Operations in Japan.

14 Jul 2011

SUSS MicroTec Launch First Holistic In-Fab EUVL Mask Management System

Today SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, launched its new MaskTrack Pro InSync - the first holistic in-fab EUVL mask management offerin...

From SUSS MicroTec AG 13 Jul 2011

Mattson Technology Releases paradigmE Si for Silicon Etch Applications

Mattson Technology has released the paradigmE Si into the market, which is useful for semi-crucial silicon etch applications.

13 Jul 2011

SACHEM and Avantor to Develop Selective Etch Solutions for Semiconductor Industries

Avantor Performance Materials have signed a joint development agreement (JDA) with SACHEM to deliver customized, next-generation selective etch chemical solutions to be suitable for semiconductor manufacturing.

13 Jul 2011

Entegris and CEA-Leti to Address Molecular Contamination Problems Between Semiconductor Wafers and Containers

Entegris and CEA-Leti have signed a two-year contract to observe cross-molecular contamination that occurs between semiconductor containers and wafers.

From CEA-Leti 13 Jul 2011

Physicists Develop New Process to Generate Positronium to Study Antimatter

The University of California, Riverside physicists have found a new approach to generate positronium, an atom with a short lifespan, to help solve queries related to antimatter in the universe such as why nature preferred matter over antimatter when the universe was created.

13 Jul 2011

Tanaka Kikinzoku Kogyo and SUSS MicroTec to Develop Wafer Bonding Technology

SUSS MicroTec will collaborate with Tanaka Kikinzoku Kogyo to develop bonding technology and pattern transfer with the help of gold particles of sub-micron dimensions.

13 Jul 2011

Synopsys Introduces IC Compiler Configuration to Support IC Manufacturing at 20 nm

Synopsys has introduced the IC Compiler-Advanced Geometry, a new version of its IC compiler, to provide design support for double-patterning technology (DPT), which serves as a pre-requisite for advanced silicon technology at 20 nm and imposes stringent restrictions on routing, placement and physical validation.

13 Jul 2011

SilconBlue Fabricates LP-Series and XP Series CMDs on TSMC 40nm CMOS Process

SiliconBlue Technologies, a manufacturer of custom mobile device (CMD) solutions, has declared that samples of the novel iCE40 Los Angeles mobileFPGA including low-power series (LP) for smartphones and the high-speed (HX–Series) for tablets are available and fully functional.

12 Jul 2011

Imec Prints First Extreme-Ultraviolet Wafers with the ASML Preproduction Tool

Imec announces that it has successfully printed first Extreme-Ultraviolet (EUV)-light wafers with the ASML NXE:3100 preproduction scanner using XTREME technologies (a wholly owned subsidiary of Ushio Inc.) Laser assisted Discharge Plasma (LDP) source.

From IMEC 11 Jul 2011