Nanofabrication News

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New Facility Will Transform Researchers' Ability to Quickly Develop New Nanofabricated Materials and Devices

SFU's 4D LABS materials science research centre is getting about $884,000 from Western Economic Diversification Canada to add new scientific equipment for faster prototyping.

9 Jul 2009

Aerosol Jet Will Enable Advanced Multi-Chip Packages for Mobile Product Applications

Optomec, Inc. and Vertical Circuits, Inc. (VCI) announced today that they are collaborating in the development of a high density 3-dimensional interconnect solution that will enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance Multi-Chip Packages (MCPs).

From Optomec 9 Jul 2009

Researchers Demonstrate Way to Fabricate Efficient Solar Cells from Low-Cost and Flexible Materials

Researchers at the U.S. Department of Energy's Lawrence Berkeley National Laboratory and the University of California at Berkeley have demonstrated a way to fabricate efficient solar cells from low-cost and flexible materials.

From Lawrence Berkeley National Laboratory 9 Jul 2009

Sematech Selects EVG's Fully Automated 300-mm GEMINI Wafer Bonder for Enabling Next-Gen TSV and 3D Interconnects

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that SEMATECH, the global consortium of chipmakers, has selected EVG&#...

9 Jul 2009

Alchimer Announces Aquivia Deposition Process Ready For Implementation

Alchimer S.A., a leading provider of cost-saving coating processes for interconnections in advanced 3D-packaging applications, announced today that its cost-saving AquiVia™ deposition process is ready for implementation.

9 Jul 2009

Bruker AXS Receives Order from SEMATECH

Bruker AXS is pleased to announce that SEMATECH has ordered the Bruker X-ray tools D8 FABLINE™ and D8 DISCOVER™ for the X-ray metrology site at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

8 Jul 2009

4Wave Receives Multi-System Order for Ion Beam Etching from Leading U.S. Defense Contractor

4Wave Inc., a leading thin film equipment manufacturer and provider of thin film coatings, announced today that it has received a multi-system order for ion beam etching from a leading U.S. defense contractor. This comes...

8 Jul 2009

Uni-Pixel Joins Center for Advanced Microelectronics Manufacturing at Binghamton University

Uni-Pixel, Inc. (BULLETIN BOARD: UNXL), the developer of a color display technology called Time Multiplexed Optical Shutter ("TMOS"), today announced that it has joined the Center for Advanced Microelectronics Manufacturing (CAMM) at Binghamton University, State University of New York.

8 Jul 2009

Temporary Bonding Solution for Emerging 3D Integration and Packaging Technologies

SUSS MicroTec (FWB:SMH)(GER:SMH), one of the leading suppliers of process and test solutions for microstructuring applications in semiconductor and related markets, and Thin Materials, a semiconductor process development...

From SUSS MicroTec AG 8 Jul 2009

Leti Collaboration Will Boost Mastering Fabrication Process

Replisaurus Technologies, Inc. today announced a common laboratory agreement with CEA-Leti, which maintains one of the world's leading research centers for applied electronics in Grenoble, France. The agreement marks...

From CEA-Leti 7 Jul 2009

Nanofabrication News

New Facility Will Transform Researchers' Ability to Quickly Develop New Nanofabricated Materials and Devices

Aerosol Jet Will Enable Advanced Multi-Chip Packages for Mobile Product Applications

Researchers Demonstrate Way to Fabricate Efficient Solar Cells from Low-Cost and Flexible Materials

Sematech Selects EVG's Fully Automated 300-mm GEMINI Wafer Bonder for Enabling Next-Gen TSV and 3D Interconnects

Alchimer Announces Aquivia Deposition Process Ready For Implementation

Bruker AXS Receives Order from SEMATECH

4Wave Receives Multi-System Order for Ion Beam Etching from Leading U.S. Defense Contractor

Uni-Pixel Joins Center for Advanced Microelectronics Manufacturing at Binghamton University

Temporary Bonding Solution for Emerging 3D Integration and Packaging Technologies

Leti Collaboration Will Boost Mastering Fabrication Process

Harnessing Biology for Sustainable Energy Production

Calcium Carbonate Nanoparticles: Boosting T Cell Activation in Cancer Therapy

Low-Temperature Synthesis of Ultrathin Two-Dimensional Materials via BiOCl-Assisted CVD

Enhancing Material Properties through Nanotube Encapsulation

Unraveling the Mysteries of Nanobubble Stability

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials