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Cadence Innovus Implementation System Achieves Certification for TSMC’s V0.9 of 10nm FinFET Process

Cadence Design Systems, Inc. today announced that its Cadence® Innovus™ Implementation System has achieved V0.9 certification for TSMC’s 10nm FinFET process and is currently on track to complete V1.0 in Q4 2015.

From Cadence Design Systems 18 Sep 2015

TSMC Certifies Cadence Digital, Custom/Analog and Signoff Tools for V0.9 10nm Process

Cadence Design Systems, Inc. today announced that its digital, custom/analog and signoff tools have achieved certification from TSMC for V0.9 of its 10nm process and are currently on track to achieve V1.0 completion by Q4 2015. The certification enables systems and semiconductor companies to deliver advanced-node designs to market faster for mobile phones, tablets, application processors and high-end servers.

From Cadence Design Systems 18 Sep 2015

Simgui Commences Production of 200mm SOI Wafers using Soitec's Smart Cut Technology

Soitec (Euronext), a world leader in generating and manufacturing semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese silicon-based semiconductor materials company, jointly announced today that the first 200-mm silicon-on-insulator (SOI) wafers have been produced at Simgui's manufacturing facility in Shanghai using Soitec's proprietary Smart Cut(TM) technology, and will be shipped within the next weeks for customer's qualification.

16 Sep 2015

ATopTech Completes Certification of Aprisa and Apogee Place and Route Solutions for TSMC 10nm FinFET Process

ATopTech, a leader in next generation physical design solutions, has collaborated with TSMC and completed the certification of Aprisa™ and ApogeeTM, ATopTech’s place and route solutions, for TSMC V0.9 of 10nm FinFET process. Both companies continue to work on the completion of 10 nanometer certification of V1.0, targeting Q4, 2015. ATopTech also is included in the TSMC 10nm reference flow and is a member of TSMC’s Open Innovation Platform® (OIP).

16 Sep 2015

Blueshift Introduces 50µm Thick AeroZero Polymer Aerogel with Nano-Sized Pores

Blueshift International Materials, Inc., creators of best-in-class, state-of-the-art, lightweight materials, today announced a 50 micron thickness of AeroZero™, a lightweight, 100 percent-polymer aerogel that is easily incorporated into electronics and composites. The thinner AeroZero Film enables lightweight, higher-performing products, with superior insulation and RF capabilities.

15 Sep 2015

Silvaco's InVar Gate Level EM/IR Analysis Solution for 16nm 16FF+ Process Receives TSMC Certification

Silvaco, Inc. today announced that TSMC has certified Silvaco's InVar electromigration (EM)/voltage drop (IR) analysis tools for 16-nanometer (nm) FinFET Plus (16FF+) Design Rule Manual (DRM) and SPICE model version 1.0 (v1.0). Silvaco's suite of power integrity signoff tools, InVar Power and EM/IR, provides users a complete solution, from early power analysis to signoff for digital gate-level designs.

14 Sep 2015

SRC Expands Benchmarking Research for Evaluating Relative Capabilities of Emerging Devices

Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research — a unique program that evaluates the relative capabilities of new and emerging computing devices.

10 Sep 2015

Renesas Deploys Synopsys' Design Compiler Graphical for Automotive ICs using 40nm Process

Synopsys, Inc., today announced that Renesas, a leading solution provider delivering highly reliable and high-safety products for automotive, has deployed Synopsys' Design Compiler® Graphical solution for their designs.

From Synopsys, Inc. 10 Sep 2015

Broad Ion Beam Irradiation Enables Self-Organization of Nanostructured Arrays

Many semiconductor devices in modern technology – from integrated circuits to solar cells and LEDs – are based on nanostructures. Producing arrays of regular nanostructures usually requires substantial effort. If they were self-organized, the production of such devices would be considerably faster and the costs would therefore sink.

10 Sep 2015

Nano Dimension Announces Sale of 3D Printers to ALA Software Solutions

Nano Dimension, a leading printing electronics company in the area of 3D printing, announced today that Nano Dimension Technologies, a fully owned subsidiary of Nano Dimension, has sold 3D printers to ALA Software Solutions in the total amount of $175,000.

9 Sep 2015

Nanofabrication News

Cadence Innovus Implementation System Achieves Certification for TSMC’s V0.9 of 10nm FinFET Process

TSMC Certifies Cadence Digital, Custom/Analog and Signoff Tools for V0.9 10nm Process

Simgui Commences Production of 200mm SOI Wafers using Soitec's Smart Cut Technology

ATopTech Completes Certification of Aprisa and Apogee Place and Route Solutions for TSMC 10nm FinFET Process

Blueshift Introduces 50µm Thick AeroZero Polymer Aerogel with Nano-Sized Pores

Silvaco's InVar Gate Level EM/IR Analysis Solution for 16nm 16FF+ Process Receives TSMC Certification

SRC Expands Benchmarking Research for Evaluating Relative Capabilities of Emerging Devices

Renesas Deploys Synopsys' Design Compiler Graphical for Automotive ICs using 40nm Process

Broad Ion Beam Irradiation Enables Self-Organization of Nanostructured Arrays

Nano Dimension Announces Sale of 3D Printers to ALA Software Solutions

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Novel Method for Producing Superior Carbon Nanofibers via Additive Nanostructuring

Optimizing Methylene Blue Removal with Bovine Serum Albumin Nanoparticles

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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