TowerJazz, the global specialty foundry leader, and TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) – a newly established company by Panasonic Corporation of which Tower Semiconductor Ltd. acquired 51%, and Synopsys, Inc., a global leader in electronic design automation (EDA) and semiconductor IP, today announced that they have qualified a 65 nanometer (nm) CMOS image sensor (CIS) interoperable process design kit (iPDK) to allow customers to design and develop new products using Synopsys’ custom design solution.
Ultratech, Inc., a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and highbrightness LEDs (HB LEDs), as well as atomic layer deposition (ALD) systems, announced that its Cambridge NanoTech business unit Ultratech-CNT has delivered a new, second-generation production tool, the Phoenix G2 Batch ALD system to a major Japanese manufacturer.
Today, Micron Technology, Inc. announced a new addition to its expansive portfolio of flash storage products, providing a purpose-built solution for cost-sensitive consumer applications seeking high performance and reliability.
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's lowest-power Gigabit Ethernet (GbE) switch for home gateways, small business switch systems and wireless router applications.
EULITHA, a Swiss startup company offering innovative lithography equipment and services for the nanotechnology, photonics and optoelectronic markets announced today the delivery of its unique PhableR 100 photolithography tool to the MESA + NanoLab of the University of Twente in the Netherlands.
Synopsys, Inc. today announced STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has taped out their latest fully depleted silicon on insulator (FD-SOI) system on chip (SoC) using Synopsys' IC Compiler™ II place and route solution.
Stanford University scientists have created a new carbon material that significantly boosts the performance of energy-storage technologies. Their results are featured on the cover of the journal ACS Central Science.
ANSYS, Inc. and TowerJazz, a leader in specialty foundry technology, are working to meet the growing demands for automotive, medical and Internet of Things (IoT) applications where product reliability and robustness are paramount. This collaboration has enabled TowerJazz to certify ANSYS® Totem™ and ANSYS® PathFinder™ software for its 180-nanometer (nm) process family design kits (PDKs) and reference design flow.
Ceapro Inc. ("Ceapro" or the "Company"), a growth-stage biotechnology company focused on the development and commercialization of active ingredients for the healthcare and cosmetic industries, announced today it will embark on a scale-up of its proprietary PGX technology to commercial and demonstration levels.
Xilinx, Inc. announced that it has collaborated with TSMC on the 7nm process and 3D IC technology for its next generation of All Programmable FPGAs, MPSoCs, and 3D ICs. The technology represents the fourth consecutive generation where the two companies have worked together on advanced process and CoWoS 3D stacking technology, and will become TSMC's fourth generation of FinFET technology. The collaboration will provide Xilinx a multi-node scaling advantage and build on its outstanding product, execution, and market success at 28nm, 20nm, and 16nm nodes.
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