Research and Markets has announced the addition of the "Nanoencapsulation for Food Products - Global Strategic Business Report" report to their offering.
Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it is the first company to deliver silicon-proven 28G NRZ SerDes IP on the TSMC 16-nanometer FinFET Plus (16FF+) process, and will demonstrate its high-performance, low power characteristics at the TSMC Symposium this week in Shanghai, China.
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aigner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required.
Micro actuators are needed for numerous applications, ranging from mobile and wearable devices to minimally invasive medical devices. However, the limitations associated with their fabrication have restricted their deployment at the one-millimeter scale. The most common electromagnetic motors require the miniaturization of many complicated components such as coils, magnets, and bearings, and exhibit severe torque dissipation due to the scaling. Electrostatic motors enable excellent scalability by using microelectromechanical systems (MEMS) technology, but their weak driving force has limited their further development.
SENTECH offers leading edge plasma process technology equipment for etching, deposition and thin film measurement instrumentation based on ellipsometry. The advanced SENTECH plasma equipment is based on the inductively coupled plasma source PTSA (planar triple spiral antenna) which was developed by SENTECH for low damage and high rate etching and deposition. The latest product development at SENTECH expands the ICPECVD product line by plasma enhanced ALD systems and in situ monitoring systems.
Uniquify today announced it developed a DDR3 intellectual property (IP) solution for Samsung Electronics' power-efficient 28nm LPP foundry process that is now in volume production for multiple product lines, including consumer and mobile applications.
As microchip feature dimensions approach atomic scale, it becomes formidably difficult to measure their size and shape. According to the International Technology Roadmap for Semiconductors, within the next couple of years the typical length of a transistor’s “gate” – its on-off switch – will be less than 20 nanometers (nm, billionths of a meter).
With some ingenuity and interdisciplinary help, Nick Kaplinsky’s pipe dream became a reality.
For the first time, nanomagnet islands or arrays were arranged into an exotic structure (called “shakti”) that does not directly relate to any known natural material. The shakti artificial spin ice configuration was fabricated and reproduced experimentally.
Rudolph Technologies, Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fan-out wafer level packaging (FOWLP) applications.
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