Nanofabrication News

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New Ultra-Low Power Technology Platform for IoT and Wearable Device Applications from TSMC

TSMC today announced the foundry segment's first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications.

30 Sep 2014

ATopTech Optimizes Physical Implementation Tools to Support TSMC 16nm FinFET Plus Designs

ATopTech, a leader in next generation physical design solutions, continued their ongoing collaboration with TSMC by further optimizing ATopTech physical implementation tools to support advanced designs in TSMC 16nm FinFET Plus (16FF+) V0.9 Design Rule Manual and SPICE model.

30 Sep 2014

ANSYS’ RedHawk and Totem Products Receive Certification for TSMC 16-nm FinFET+Technology

ANSYS announced today that its RedHawk™ and Totem™ products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET technology delivering power, performance and area advantages over the previous generation.

30 Sep 2014

TSMC Certifies Cadence Digital and Custom/Analog Tools for 16FF+ Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that its digital and custom/analog tools have achieved V0.9 Design Rule Manual (DRM) and SPICE certification from TSMC for its 16FF+ process, enabling systems and semiconductor companies to take advantage of the 15 percent speed improvement with the same total power compared to 16nm FinFET, or 30 percent total power reduction at the same speed compared to 16nm FinFET.

From Cadence Design Systems 29 Sep 2014

Toshiba Introduces Extremely Low-Power 2.4 GHz VCO using 28nm CMOS Technology

Toshiba Corporation today announced that it has developed an extremely low-power 2.4 GHz Voltage Controlled Oscillator (VCO) for low-power wireless systems, such as Bluetooth® Low Energy (BLE).

29 Sep 2014

Cadence Introduces Broad Portfolio of IP for TSMC’s 16nm FinFET Plus Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process.

From Cadence Design Systems 29 Sep 2014

Veeco’s EPIK700 MOCVD System Accepted by Epistar for High Volume LED Production

Veeco Instruments Inc. announced today that Epistar Corporation has successfully evaluated and accepted the new TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system for the production of light emitting diodes (LEDs).

29 Sep 2014

TSMC Certifies Mentor Graphics’ AFS Mega, Eldo Platforms for 16nm FinFET+ Processes

Mentor Graphics Corp. today announced that the Analog FastSPICE (AFS™) Platform including AFS Mega and Eldo® have been certified for 16nm FinFET+ V0.9 process technology through TSMC's SPICE Simulation Tool Certification Program, and on-going certification of V1.0 is on track to be completed by November, 2014.

29 Sep 2014

Research on Nanowire-Based TFETs May Help Reduce Power Consumption of Electronics

TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology.

29 Sep 2014

The Inkjet Conference: Phoseon to Showcase Advanced UV LED Curing Solutions

Phoseon will be displaying state of the art UV LED curing solutions for printing applications at The Inkjet Conference™ (TheIJC.com), to be held in the Swissôtel in Neuss (Düsseldorf), Germany, September 30 and October 1, 2014.

29 Sep 2014

Nanofabrication News

New Ultra-Low Power Technology Platform for IoT and Wearable Device Applications from TSMC

ATopTech Optimizes Physical Implementation Tools to Support TSMC 16nm FinFET Plus Designs

ANSYS’ RedHawk and Totem Products Receive Certification for TSMC 16-nm FinFET+Technology

TSMC Certifies Cadence Digital and Custom/Analog Tools for 16FF+ Process

Toshiba Introduces Extremely Low-Power 2.4 GHz VCO using 28nm CMOS Technology

Cadence Introduces Broad Portfolio of IP for TSMC’s 16nm FinFET Plus Process

Veeco’s EPIK700 MOCVD System Accepted by Epistar for High Volume LED Production

TSMC Certifies Mentor Graphics’ AFS Mega, Eldo Platforms for 16nm FinFET+ Processes

Research on Nanowire-Based TFETs May Help Reduce Power Consumption of Electronics

The Inkjet Conference: Phoseon to Showcase Advanced UV LED Curing Solutions

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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