Nanofabrication News

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H2W Introduces LSS Series Linear Stepper Positioning Stage

H2W introduces the LSS-060-04-006-MElinear stepper positioning stage which is part of the LSS series family. This stage has a stroke of 60 in [1500 mm] and generates 6lbs [26.6 N] of continuous force. It incorporates a 1 micron resolution linear encoder, which when operated under closed loop control, improves system accuracy and repeatability.

From H2W Technologies 11 Jul 2014

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. In the future they are going to operate under the corporate roof of temicon, continuing the well established brand “holotools” as their trademark for laser interference lithography.

11 Jul 2014

CiS Research Institute Place Order for Oxford Instruments Plasma Etch System for MEMS R&D

The CiS Research Institute for Microsensor Systems and Photovoltaics GmbH, Germany has recently placed an order with Oxford Instruments for a PlasmaPro100 Estrelas etch system for research & development of MEMS components.

From Oxford Instruments Plasma Technology 10 Jul 2014

CNSE/ SUNYIT and Nikon to Showcase Fully Patterned 450mm Wafers at SEMICON West

Demonstrating significant progress in the industry transition to 450mm wafer technology, and in support of New York Governor Andrew M. Cuomo’s commitment to New York’s leadership in the development of next generation technologies, the newly merged SUNY College of Nanoscale Science and Engineering (CNSE)/SUNY Institute of Technology (SUNYIT), along with Global 450mm Consortium (G450C) partner Nikon Corporation, today announced the world’s first fully patterned 450mm wafers will be revealed at SEMICON West.

From College of Nanoscale Science and Engineering, University at Albany 10 Jul 2014

memsstar Introduces New Etch and Deposition Process Tools for MEMS Manufacturing

memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today launched its ORBIS™ platform of etch and deposition process tools for MEMS manufacturing. ORBIS systems deliver the industry's most advanced single-wafer process capability, required to meet the uniformity and repeatability requirements for advanced MEMS manufacturing.

From memsstar Ltd. 9 Jul 2014

New Excimer Laser Debonder from SUSS MicroTec

SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched an excimer laser debonder, the ELD300, for the stress free debonding of 200 and 300mm 3D-IC wafers, today.

From SUSS MicroTec AG 9 Jul 2014

FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

FinScale Incorporated,the semiconductor device and process innovation company, today announced immediate availability of its qFinFET™ technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers.

9 Jul 2014

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Hitachi has taped out its latest giga-scale design using the Cadence Tempus™ Timing Signoff Solution. Hitachi also utilized Tempus Timing Signoff Optimization (TSO), resulting in a reduction of their overall closure time to just 3 weeks down from almost 2 months.

From Cadence Design Systems 8 Jul 2014

Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.

8 Jul 2014

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

Advanced Micro-Fabrication Equipment Inc. (AMEC) today introduced the Primo Integrated Dual-Station Etch and plasma downstream Asher ( Primo iDEA™), an industry-first semiconductor processing tool that integrates dual-station dielectric etch and photoresist strip chambers onto the same platform.

8 Jul 2014

Nanofabrication News

H2W Introduces LSS Series Linear Stepper Positioning Stage

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

CiS Research Institute Place Order for Oxford Instruments Plasma Etch System for MEMS R&D

CNSE/ SUNYIT and Nikon to Showcase Fully Patterned 450mm Wafers at SEMICON West

memsstar Introduces New Etch and Deposition Process Tools for MEMS Manufacturing

New Excimer Laser Debonder from SUSS MicroTec

FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

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