Nanofabrication News

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Trends & Technology Report on Global Permanent Wafer Bonding for Semiconductor Market

Research and Markets has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering.

From Research and Markets 15 Jul 2014

Gold Plating Technique Combined with Electroforming Increases Sensitivity of Infrared Gas Sensors

A new process that combines a gold plating technique developed for the Space Program's YAG Laser Pump Cavities with the age-old manufacturing technique of electroforming, is now dramatically increasing the sensitivity of infrared gas analyzers and sensors—products that have long used infrared light to detect CO, CO2 and many other trace gases in the atmosphere. At the heart of many of these designs is an IR gas cell sometimes called a light-pipe.

15 Jul 2014

TSMC Certifies Cadence Quantus QRC Extraction Solution for TSMC 16nm FinFET

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that TSMC has certified Cadence Quantus QRC Extraction solution for TSMC 16nm FinFET. Cadence Quantus QRC Extraction Solution successfully passed TSMC's rigorous parasitic extraction certification requirements to achieve best-in-class accuracy against the foundry golden data for FinFET technology.

From Cadence Design Systems 15 Jul 2014

Lincoln Electric Granted Exclusive Worldwide License to NanoSteel’s Coatings Technology

The NanoSteel® Company and Lincoln Electric announced today that NanoSteel has granted Lincoln Electric an exclusive worldwide license to the company's proprietary steel coatings technology for weld overlay and thermal spray applications. This agreement expands Lincoln Electric's range of wear resistant products, which complement the company's core arc welding, cutting and automation solutions.

11 Jul 2014

New Nanoengineering Undergraduate Certificate Program at Wayne State

Beginning in winter 2015, Wayne State University’s College of Engineering will offer a nanoengineering undergraduate certificate program that will provide students with in-depth training in the emerging area of nanotechnology. The program will offer new lecture, laboratory and seminar courses that cross traditional departmental and disciplinary boundaries.

11 Jul 2014

SUNY CNSE/SUNYIT and SEMATECH Create Chemical Mechanical Planarization Center

The newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) and SEMATECH today announced the creation of the Chemical Mechanical Planarization (CMP) Center, based at the Albany Nanotech Complex.

From College of Nanoscale Science and Engineering, University at Albany 11 Jul 2014

Entegris Introduces Nondewetting PTFE Filter with 10 nm Particle Retention for Wet Etch Applications

Entegris, Inc., a leader in yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the latest addition to its Torrento® family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

From Entegris 11 Jul 2014

H2W Introduces LSS Series Linear Stepper Positioning Stage

H2W introduces the LSS-060-04-006-MElinear stepper positioning stage which is part of the LSS series family. This stage has a stroke of 60 in [1500 mm] and generates 6lbs [26.6 N] of continuous force. It incorporates a 1 micron resolution linear encoder, which when operated under closed loop control, improves system accuracy and repeatability.

From H2W Technologies 11 Jul 2014

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

The two German high-tech companies temicon GmbH and holotools GmbH join forces to expand their product portfolio in the area of micro and nanotechnologies. In the future they are going to operate under the corporate roof of temicon, continuing the well established brand “holotools” as their trademark for laser interference lithography.

11 Jul 2014

CiS Research Institute Place Order for Oxford Instruments Plasma Etch System for MEMS R&D

The CiS Research Institute for Microsensor Systems and Photovoltaics GmbH, Germany has recently placed an order with Oxford Instruments for a PlasmaPro100 Estrelas etch system for research & development of MEMS components.

From Oxford Instruments Plasma Technology 10 Jul 2014

Nanofabrication News

Trends & Technology Report on Global Permanent Wafer Bonding for Semiconductor Market

Gold Plating Technique Combined with Electroforming Increases Sensitivity of Infrared Gas Sensors

TSMC Certifies Cadence Quantus QRC Extraction Solution for TSMC 16nm FinFET

Lincoln Electric Granted Exclusive Worldwide License to NanoSteel’s Coatings Technology

New Nanoengineering Undergraduate Certificate Program at Wayne State

SUNY CNSE/SUNYIT and SEMATECH Create Chemical Mechanical Planarization Center

Entegris Introduces Nondewetting PTFE Filter with 10 nm Particle Retention for Wet Etch Applications

H2W Introduces LSS Series Linear Stepper Positioning Stage

temicon and holotools Join Forces to Speed up Market Introduction of Nanostructure Technologies

CiS Research Institute Place Order for Oxford Instruments Plasma Etch System for MEMS R&D

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Gold Nanoparticles to Restore Vision in Retinal Disorders

Study Shows Potential for New Treatments for Neurological and Inflammatory Diseases

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

Sponsored Content

Utilizing Back-Gate Voltage Biases for 2D Materials

Resistivity Metrology for Sputtered ITO Thin Films

How Plasma Cleaning Technology Tackles Hydrocarbon Contamination

Optimizing EV Lubricants with Electrified Tribotesting