Nanofabrication News

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SENTECH Instruments Announce Successful Ellipsometer Workshop in Dresden

This Workshop took place in March at the Leibniz Institute of Polymer Research. Scientists and engineers from the metrology society discussed recent developments in science, technology and application for Ellipsometry.

From Sentech Instruments 28 Apr 2014

Altera Showcases FPGA Technology Based on Intel's 14 nm Tri-Gate Process

Altera Corporation today announced the demonstration of its FPGA technology based on Intel's 14 nm Tri-Gate process.

25 Apr 2014

Research and Markets Adds Report on Nanocoatings

Research and Markets has announced the addition of the "Nanocoatings: The Global Market to 2020" report to their offering.

From Research and Markets 23 Apr 2014

Altera Partners with TSMC for Bringing its Bump-Based Packaging to Altera's 20nm SoCs

Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera's 20 nm device family.

From TSMC Taiwan Semiconductor Manufacturing Company 23 Apr 2014

Mercury Systems Opens New Advanced Microelectronics Center in Hudson

Mercury Systems, Inc., a best-of-breed provider of commercially developed, open sensor and Big Data processing systems for critical commercial, defense and intelligence applications, celebrated the grand opening of its new Advanced Microelectronics Center (AMC) in Hudson, New Hampshire on Friday, April 18, 2014.

22 Apr 2014

Toshiba to Enable FFSA and ASIC Solutions on GLOBALFOUNDRIES’ Technologies

GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GLOBALFOUNDRIES’ technologies and services for customers across the globe.

From GlobalFoundries 22 Apr 2014

Samsung and GLOBALFOUNDRIES Collaborate to Offer 14nm FinFET Technology

Samsung Electronics Co., Ltd. and GLOBALFOUNDRIES today announced a new strategic collaboration to deliver global capacity for 14 nanometer (nm) FinFET process technology. For the first time, the industry’s most advanced 14nm FinFET technology will be available at both Samsung and GLOBALFOUNDRIES, giving customers the assurance of supply that can only come from true design compatibility at multiple sources across the globe.

From GlobalFoundries 21 Apr 2014

Novel Breakthrough Enables Nanofabrication of Porous Graphene Membranes

Researchers have produced a stable porous membrane that is thinner than a nanometre. This is a 100,000 times thinner than the diameter of a human hair. The membrane consists of two layers of the much exalted "super material" graphene, a two-dimensional film made of carbon atoms, on which the team of researchers, led by Professor Hyung Gyu Park at the Department of Mechanical and Process Engineering at ETH Zurich, etched tiny pores of a precisely defined size.

18 Apr 2014

University of Chicago to Build Pritzker Nanofabrication Facility

The University of Chicago’s Institute for Molecular Engineering will build a major new facility for nanoscale fabrication within the William Eckhardt Research Center, supported by a $15 million gift from the Pritzker Foundation.

17 Apr 2014

Cadence Digital and Custom/Analog Tools Receive V1.0 DRM Certification for TSMC’s 16nm FinFET Process

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced its digital, custom and signoff tools have received V1.0 Design Rule Manual (DRM) and SPICE certification for TSMC’s 16nm FinFET process, enabling joint customers to begin taping out FinFET-based designs using Cadence® tools.

From Cadence Design Systems 16 Apr 2014