Nanofabrication News

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Mikron to Leverage Cadence EDA Tools for 90 nm IC Design Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, and JSC Mikron, the largest manufacturer and exporter of microelectronics and RFIDs in Russia and CIS (Community of Independent States), part of the industrial holding “RTI Systems”, announced today that Mikron has licensed Cadence® Physical Verification System (PVS) and Cadence QRC Extraction to be used in Mikron’s basic 90nm IC design flow.

From Cadence Design Systems 14 Mar 2014

Researchers Fabricate Thin Films of Spin Ice with Thicknesses of Only a Few Nanometres

Thin films of spin ice have been shown to demonstrate surprising properties which could help in the development of applications of magnetricity, the magnetic equivalent of electricity.

13 Mar 2014

Cadence, GLOBALFOUNDRIES Tape Out Quad Core Test Chip Built Around ARM Cortex-A12 Processor

Cadence Design Systems Inc. and GLOBALFOUNDRIES announced that they have taped out a quad core test chip built around the ARM Cortex-A12 processor. Targeted to operate at frequencies of up to 2.0GHz while still within the mainstream mobile power and area envelope, the test chip is implemented in GLOBALFOUNDRIES’ 28nm-SLP (Super Low Power 28 nanometer High-K Metal Gate) process using a full Cadence® tool flow and incorporates ARM POP™ technology to leverage the full performance range of the 28-SLP process.

From GlobalFoundries 13 Mar 2014

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first triple speed 10/40/100G Lite physical layer transceiver (Lite-PHY) designed for high-density data center applications.

12 Mar 2014

FCI to Present on Dielectric Laser via Drilling for Next Generation Wafer Level Processing at IMAPS 2014

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS – 10th International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA.

10 Mar 2014

Ultrathin Layers of Tungsten and Selenium Hold Promise for Solar Cells

Ultrathin layers made of Tungsten and Selenium have been created at the Vienna University of Technology; experiments show that they may be used as flexible, semi-transparent solar cells

10 Mar 2014

Nanofabrication Advances Help Improve Resolution of Nanoscale Biosensors

Over the past half-century, biosensors have opened a new window on the physical world while revolutionizing much of modern society.

6 Mar 2014

Advanced Wavelength Scanning Interferometer to be Installed at CPI’s National Printable Electronics Centre

As part of the FP7 NanoMend project, The Centre for Process Innovation (CPI), IBS Precision Engineering and The University of Huddersfield have been working together to design and manufacture a state-of-the-art Wavelength Scanning Interferometer system that enables the fast surface measurement of low contrast defects at pre-industrial scale.

From CPI Head Office 3 Mar 2014

Increasing Adoption of Mobile Devices Drives Global Wafer-level Packaging Equipment Market

Research and Markets has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering.

From Research and Markets 3 Mar 2014

Invenios Ambient Temperature Bonding Micro-System Production Process Now Supports Silicon, Metal Substrates

Invenios, an advanced technology micro-fabrication foundry specializing in microfluidics, MEMS, and 3D microstructures announced the addition of silicon and metal substrates to the range of materials utilizing the firm's innovative Ambient Temperature Bonding (ABT) micro-system production process for the permanent bonding of substrates, such as silicon-to-glass, metal-to-glass, and glass-to-glass at room temperatures without the use of electrostatics, heat or adhesives.

28 Feb 2014

Nanofabrication News

Mikron to Leverage Cadence EDA Tools for 90 nm IC Design Flow

Researchers Fabricate Thin Films of Spin Ice with Thicknesses of Only a Few Nanometres

Cadence, GLOBALFOUNDRIES Tape Out Quad Core Test Chip Built Around ARM Cortex-A12 Processor

Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

FCI to Present on Dielectric Laser via Drilling for Next Generation Wafer Level Processing at IMAPS 2014

Ultrathin Layers of Tungsten and Selenium Hold Promise for Solar Cells

Nanofabrication Advances Help Improve Resolution of Nanoscale Biosensors

Advanced Wavelength Scanning Interferometer to be Installed at CPI’s National Printable Electronics Centre

Increasing Adoption of Mobile Devices Drives Global Wafer-level Packaging Equipment Market

Invenios Ambient Temperature Bonding Micro-System Production Process Now Supports Silicon, Metal Substrates

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

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The Evolution of Lipid Nanoparticles

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