ISSC Technologies Corporation, a leading developer of advanced wireless solutions, today announced the immediate availability of the KleanWireTM IS2000 family of products. KleanWireTM is built on a low power, 55 nanometer process, offering a low energy, high performance dual mode Bluetooth class-D audio amplifier for advanced audio applications.
A team of UConn chemists has discovered a new way of making a class of porous materials that allows for greater manufacturing controls and has significantly broader applications than the longtime industry standard.
DryWired™ announced today that it is expanding its customized surface modification product portfolio to include the DryWired™ Nebula and the Nebula Junior. These revolutionary patent- pending desktop nanocoating systems are low cost, compact, and ideal for electronic retailers looking to offer invisible water repellent nanocoatings directly to their customers.
Last week, we announced that Integran received an award from the DoD's SERDP office for our work on environmentally benign plating for toxic beryllium replacement, which is particularly interesting for high load bushings, like the all-Nanovate Metal Bushings shown here.
Altatech, a subsidiary of Soitec, and Helmholtz-Zentrum Berlin für Materialien und Energie (HZB), a member of the Helmholtz Association of German Research Centres, have launched a collaborative partnership to research and develop materials for the next generation of high-efficiency solar cells, including new classes of materials and innovative device structures for photovoltaic and photocatalysis applications.
Electronics are getting smaller all the time, but there's a limit to how tiny they can get with today's materials. Researchers now say, however, that they have developed a way to shrink capacitors — key components that store energy — even further, which could accelerate the development of more compact, high-performance next-gen devices. The study appears in the journal ACS Nano.
Toshiba Corporation today announced the launch of the “HG6 series” of client SSDs integrating NAND chips fabricated with 19nm second-generation process technology. Shipping will start from March.
The future of computing may lie not in electrons, but in photons – that is, in microprocessors that use light instead of electrical signals. But these so-called photonic devices are typically built using customized methods that make them difficult and expensive to manufacture.
Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced that it has developed the industry's first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28 nm process technology.
GT Advanced Technologies today announced that it has acquired exclusive rights from Kyma Technologies, Inc. for its plasma vapor deposition (PVD) process technology and know-how. The PVD of nano-columns (PVDNC™) technology developed by Kyma deposits a high-quality growth initiation layer of aluminum nitride (AlN) on wafers prior to gallium nitride (GaN) deposition.
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