Nanofabrication News

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Broadcom Unveils BCM82322 Lite-PHY Fabricated in 28nm CMOS Technology

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first triple speed 10/40/100G Lite physical layer transceiver (Lite-PHY) designed for high-density data center applications.

12 Mar 2014

FCI to Present on Dielectric Laser via Drilling for Next Generation Wafer Level Processing at IMAPS 2014

FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS – 10th International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA.

10 Mar 2014

Ultrathin Layers of Tungsten and Selenium Hold Promise for Solar Cells

Ultrathin layers made of Tungsten and Selenium have been created at the Vienna University of Technology; experiments show that they may be used as flexible, semi-transparent solar cells

10 Mar 2014

Nanofabrication Advances Help Improve Resolution of Nanoscale Biosensors

Over the past half-century, biosensors have opened a new window on the physical world while revolutionizing much of modern society.

6 Mar 2014

Advanced Wavelength Scanning Interferometer to be Installed at CPI’s National Printable Electronics Centre

As part of the FP7 NanoMend project, The Centre for Process Innovation (CPI), IBS Precision Engineering and The University of Huddersfield have been working together to design and manufacture a state-of-the-art Wavelength Scanning Interferometer system that enables the fast surface measurement of low contrast defects at pre-industrial scale.

From CPI Head Office 3 Mar 2014

Increasing Adoption of Mobile Devices Drives Global Wafer-level Packaging Equipment Market

Research and Markets has announced the addition of the "Global Wafer-level Packaging Equipment Market 2014-2018" report to their offering.

From Research and Markets 3 Mar 2014

Invenios Ambient Temperature Bonding Micro-System Production Process Now Supports Silicon, Metal Substrates

Invenios, an advanced technology micro-fabrication foundry specializing in microfluidics, MEMS, and 3D microstructures announced the addition of silicon and metal substrates to the range of materials utilizing the firm's innovative Ambient Temperature Bonding (ABT) micro-system production process for the permanent bonding of substrates, such as silicon-to-glass, metal-to-glass, and glass-to-glass at room temperatures without the use of electrostatics, heat or adhesives.

28 Feb 2014

ISSC Offers High Performance Dual Mode Bluetooth Class-D Audio Amplifier Built on 55-nm Process

ISSC Technologies Corporation, a leading developer of advanced wireless solutions, today announced the immediate availability of the KleanWireTM IS2000 family of products. KleanWireTM is built on a low power, 55 nanometer process, offering a low energy, high performance dual mode Bluetooth class-D audio amplifier for advanced audio applications.

25 Feb 2014

New Way of Making Nanoporous Materials

A team of UConn chemists has discovered a new way of making a class of porous materials that allows for greater manufacturing controls and has significantly broader applications than the longtime industry standard.

24 Feb 2014

DryWired Introduces Low Cost, Compact, Desktop Nanocoating Systems

DryWired™ announced today that it is expanding its customized surface modification product portfolio to include the DryWired™ Nebula and the Nebula Junior. These revolutionary patent- pending desktop nanocoating systems are low cost, compact, and ideal for electronic retailers looking to offer invisible water repellent nanocoatings directly to their customers.

24 Feb 2014