ISSC Offers High Performance Dual Mode Bluetooth Class-D Audio Amplifier Built on 55-nm Process

ISSC Technologies Corporation, a leading developer of advanced wireless solutions, today announced the immediate availability of the KleanWire^TM IS2000 family of products. KleanWire^TM is built on a low power, 55 nanometer process, offering a low energy, high performance dual mode Bluetooth class-D audio amplifier for advanced audio applications.

The IS2010, IS2015, IS2020/IS2023, and IS2025 are cost effective and feature-rich wireless SOCs that support Bluetooth 4.1 headsets, headphones, speakers and many other applications. It is currently shipping to multiple global audio suppliers. KleanWire^TM will be showcased on February 26, 2014 in ISSC's Shenzhen New Products and Technologies Forum.

The IS2010 and IS2015 chips are mono speaker products with the latter equipped with a class-D audio amplifier, while the IS2020/IS2023 and IS2025 are the stereo versions. These products support Bluetooth 4.1 dual mode audio and consume only 8 mA of operational current, the lowest power consumption for Bluetooth stereo audio today. The embedded class-D audio amplifier is designed to optimally output up to 2.0Watts at 98dB signal to noise ratio (SNR), another new benchmark for the wireless audio industry. All the chips have built in multi-language capabilities and Bluetooth Low Energy (BLE) data control is available for today's Smartphone Appcessory (App-Enabled Accessory) Cloud by ISSC applications.

The IS2000 family of cost effective, low power, feature-rich and high performance chips is available for mass shipment to leading audio product makers who are always looking to position their products at the forefront of today and tomorrow's growing Bluetooth markets.

About ISSC Technology Corporation

ISSC Technologies Corporation (TWSE:5261) is a leading developer of advanced wireless solutions. Its award-winning KleanWire^TM technology enables world-class personal Bluetooth products to enrich your life wirelessly. The company is a market leader in Bluetooth SOC solutions for wireless Headset, Speaker, Connectivity, and HID products. Founded in 1999 and publicly traded on the Taiwan Stock Exchange under the code "5261" in 2013, the company is headquartered in Taiwan and has sales or research subsidiaries in Mainland China and U.S.. For more information, go to www.issc-tech.com.