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EV Group Capitalizes on MEMS Market Leadership

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding...

From EV Group 14 Jul 2010

Rudolph’s NSX System Chosen for MEMS Processing by Fraunhofer ISIT

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing.

From Onto Innovation 13 Jul 2010

MicroProbe Launches New MEMS-Based Probe Card

MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product.

13 Jul 2010

Affinity Biosensors Signs Strategic Foundry Partnership Agreement with Innovative Micro Technology

Affinity Biosensors and Innovative Micro Technology, Inc. entered into a strategic foundry partnership today for volume production of suspended mass resonator (SMR) MEMS devices enabling particle measurement in fluidic s...

12 Jul 2010

Metryx Sees Strong Growth Potential in Key New Areas Including MEMS, LEDs, and 3D IC Applications

Metryx, Limited announced that over the past six months it has seen a sharp recovery in business, with multiple Mentor mass metrology system orders received, including both new and repeat business. These orders represent...

12 Jul 2010

Lasertec Joins SEMATECH’s 3D Program at CNSE’s Albany NanoTech Complex

Lasertec Corporation of Japan has joined SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, and will partner with SEMATECH to develop robust, cost-effective process metrology technology solutions for readying high-volume via-mid through-silicon via (TSV) manufacturing.

8 Jul 2010

New, Affordable Mask and Bond Aligner from EV

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specific...

7 Jul 2010

Olympus’ LEXT OLS4000 Confocal Microscope Used for NPL Project

Olympus has today announced that the National Physical Laboratory (NPL) is using its LEXT OLS4000 in a project to establish good practice guidelines for the calibration of 3D/areal surface texture measuring instruments.

6 Jul 2010

CEA Leti Selects Eyelit’s Software Suite to Support MEMS Production in France

Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, semiconductor, and photovoltaic (solar) industries, announced today that CEA-Leti, the French nanoelectronics Research & Development plant, has purchased Eyelit’s manufacturing software suite ¯including Eyelit MES, SPC, Asset Management, Quality Management and SYSTEMA’s Equipment Integration Suite¯ to support semiconductor and MEMS production in its facilities in Grenoble, France.

From CEA-Leti 2 Jul 2010

Tegal to Supply 200 SE DRIE Tool to MEMS Research Institution in Asia Pacific

Tegal Corporation today announced it has received an order for a Tegal 200 SE™ DRIE tool from a leading Asia Pacific-based Research and Development institution investigating MEMS and associated technologies.

From Collabrx, Inc. 30 Jun 2010