Nanoelectronics News

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Minalogic to Take Part in SEMICON West 2014

Minalogic, the leading French cluster dedicated to micro- and nanoelectronics and software, has made international expansion a priority for its 2013-2018 strategy. Its attendance to SEMICON West 2014 (booth 2028) is part of this dynamic.

1 Jul 2014

SUNY CNSE/SUNYIT to Play a Major Role at SEMICON West 2014 Conference

The newly merged SUNY College of Nanoscale Science and Engineering (CNSE) / SUNY Institute of Technology (SUNYIT) announced today that it will play a pivotal role at the SEMICON West 2014 conference as its team of leading researchers, in addition to scientists from the institution’s numerous corporate partners, take part in groundbreaking presentations and informational sessions to update the computer chip industry on the advancement of semiconductor-based research and development—including innovations paving the way for the transition to the industry’s new 450mm wafer standard.

1 Jul 2014

UC Researcher Develops Novel Way to Fabricate Superconducting Nanocircuitry

For his doctoral dissertation in the Goldman Superconductivity Research Group at the University of Minnesota, Yu Chen, now a postdoctoral researcher at UC Santa Barbara, developed a novel way to fabricate superconducting nanocircuitry. However, the extremely small zinc nanowires he designed did some unexpected — and sort of funky — things.

30 Jun 2014

Integrated Sensor System to Measure Power Output of Cycle Riders

CEA-Leti and CORIMA, a leading supplier of carbon-composite wheels and frames for track and road-racing cyclists, today announced they are developing an integrated sensor system to measure the power output of riders as they pedal.

28 Jun 2014

ElectroniqueS Magazine Honors Xilinx Virtex UltraScale Device with 2014 Electron d'Or Award

Xilinx, Inc. today announced that its Virtex® UltraScale™ device won the 2014 Electron d'Or Award for Best Programmable Logic Product. Presented by ElectroniqueS Magazine in Paris on June 18, the Virtex UltraScale VU440 device with record breaking 4.4M logic cells and advanced 3D IC technology was recognized by a panel of industry experts and editors of France's leading electronics publication.

27 Jun 2014

cfaed Recognized Among Top Places to Undertake Research in Micro- and Nanoelectronics

Two years after obtaining the status of Excellence, Technische Universität Dresden (TUD) strikes a positive balance: "The Center for Advancing Electronics Dresden (cfaed) strengthens the innovative location Dresden," TUD rector Prof. Hans Müller-Steinhagen said today about the Cluster of Excellence to journalists in Dresden.

27 Jun 2014

SEMICON West: QuantumClean to Present on ‘Importance of Precision Parts Cleaning for Sub-20nm Technology Nodes’

QuantumClean® and ChemTrace® today announced that they will be exhibiting at the SEMICON West tradeshow, held at the Moscone Center in San Francisco from July 8th through the 10th, 2014.

26 Jun 2014

New Report on Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics

Research and Markets has announced the addition of the "Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics" report to their offering.

From Research and Markets 25 Jun 2014

Synopsys Offers DesignWare IP for TSMC's 28-nm High-Performance Compact Process

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the immediate availability of a wide range of DesignWare interface, analog, logic library and embedded memory IP for TSMC's 28-nanometer (nm) high-performance compact (HPC) process.

From Synopsys, Inc. 25 Jun 2014

SPTS Enters Agreement with CEA-Leti to Develop 3D High Aspect Ratio Through-Silicon-Via Solutions

SPTS Technologies, a leading manufacturer of etch, deposition and thermal processing equipment for the semiconductor industry, today announced that it has signed an agreement with CEA-Leti in Grenoble, France, to develop 3D-TSV technologies The two-year agreement enters under the framework of the Nanoelec Research Technology Institute program which is led by CEA-Leti, and covers co-development of a range of deposition processes for next-generation 3D high aspect ratio through-silicon-via (TSV) solutions.

From CEA-Leti 25 Jun 2014

Nanoelectronics News

Minalogic to Take Part in SEMICON West 2014

SUNY CNSE/SUNYIT to Play a Major Role at SEMICON West 2014 Conference

UC Researcher Develops Novel Way to Fabricate Superconducting Nanocircuitry

Integrated Sensor System to Measure Power Output of Cycle Riders

ElectroniqueS Magazine Honors Xilinx Virtex UltraScale Device with 2014 Electron d'Or Award

cfaed Recognized Among Top Places to Undertake Research in Micro- and Nanoelectronics

SEMICON West: QuantumClean to Present on ‘Importance of Precision Parts Cleaning for Sub-20nm Technology Nodes’

New Report on Materials, Processes & Tools for Roll-to-Roll Fabrication of Flexible Devices & Electronics

Synopsys Offers DesignWare IP for TSMC's 28-nm High-Performance Compact Process

SPTS Enters Agreement with CEA-Leti to Develop 3D High Aspect Ratio Through-Silicon-Via Solutions

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

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Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials