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University of Perugia and Grafen Co. Discover Efficient Method to Fabricate Graphene-printed Electronics

Scientists at University of Perugia, Italy in collaboration with Grafen Co. have discovered practical and cheap method to fabricate graphene based printed electronics.

From Grafen Chemical Industries 25 Oct 2013

Spreadtrum Licenses ARM Artisan Physical IP for SoC Designs Targeting 28nm Process

ARM and Spreadtrum, a leading fabless semiconductor provider in China, today announced a sweeping license agreement providing Spreadtrum with the full range of ARM® Artisan® physical IP, including POP™ IP, for the broad range of IC foundry and process varieties of 28nm that ARM supports to deliver the most flexible manufacturing options.

25 Oct 2013

Team to Expand Healthcare Applications for Silicon Nanotech at Imec and Johns Hopkins University

Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad...

From IMEC 24 Oct 2013

UCSB Scientists Demonstrate All-Graphene Device-Interconnect Scheme

Researchers in electrical and computer engineering at University of California, Santa Barbara have introduced and modeled an integrated circuit design scheme in which transistors and interconnects are monolithically patterned seamlessly on a sheet of graphene, a 2-dimensional plane of carbon atoms. The demonstration offers possibilities for ultra energy-efficient, flexible, and transparent electronics.

23 Oct 2013

Advantest Receives Orders for F7000 Series Electron Beam Lithography System

Advantest Corporation today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.

23 Oct 2013

Researchers Invent Novel Supercapacitor Design Using Graphene-Coated Porous Silicon

Solar cells that produce electricity 24/7, not just when the sun is shining. Mobile phones with built-in power cells that recharge in seconds and work for weeks between charges.

23 Oct 2013

All Xilinx 28nm 3D IC Families Now Reach Volume Production

Xilinx, Inc. and TSMC today announced production release of the Virtex®-7 HT family, the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device.

From TSMC Taiwan Semiconductor Manufacturing Company 21 Oct 2013

Ostendum Recognized with Frost & Sullivan Award for Lab-on-a-Chip Nanodevices Development

Based on its recent analysis of the Lab-on-a-Chip (LOC) nanodevices market, Frost & Sullivan recognizes Ostendum R&D BV (Ostendum) with the 2013 European Frost & Sullivan Award for Technology Innovation Leadership. Ostendum is a group of companies focused on the development and production of fast, highly sensitive, portable, easy-to-use and cost-effective biosensors for the instantaneous detection of micro-organisms and biomolecules, including biomarkers, proteins and nucleic acids.

From Frost and Sullivan 19 Oct 2013

Scientists Quantify Particle Fracture in Lithium Ion Batteries

Materials in lithium ion battery electrodes expand and contract during charge and discharge. These volume changes drive particle fracture, which shortens battery lifetime. A group of ETH and PSI scientists have quantified this effect for the first time using high-resolution 3D movies recorded using x-ray tomography at the Swiss Light Source.

18 Oct 2013

IEEE Nanotechnology Materials and Devices Conference 2013 Hosted by NCKU

IEEE (Institute of Electrical and Electronics Engineers) NMDC (Nanotechnology Materials and Devices Conference) 2013 kicked off, October 7, at Cheng Kung Hall, National Cheng Kung University (NCKU), southern Taiwan, with nearly 250 scholars and experts from 20 countries including USA, UK, Italy, Australia, Canada, Korea, and Japan.

17 Oct 2013

Nanoelectronics News

University of Perugia and Grafen Co. Discover Efficient Method to Fabricate Graphene-printed Electronics

Spreadtrum Licenses ARM Artisan Physical IP for SoC Designs Targeting 28nm Process

Team to Expand Healthcare Applications for Silicon Nanotech at Imec and Johns Hopkins University

UCSB Scientists Demonstrate All-Graphene Device-Interconnect Scheme

Advantest Receives Orders for F7000 Series Electron Beam Lithography System

Researchers Invent Novel Supercapacitor Design Using Graphene-Coated Porous Silicon

All Xilinx 28nm 3D IC Families Now Reach Volume Production

Ostendum Recognized with Frost & Sullivan Award for Lab-on-a-Chip Nanodevices Development

Scientists Quantify Particle Fracture in Lithium Ion Batteries

IEEE Nanotechnology Materials and Devices Conference 2013 Hosted by NCKU

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Enhancing Material Properties through Nanotube Encapsulation

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials