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Researchers Create Transparent, Flexible Piano Using Graphene-Based Ink

Two prototypes – a detection device which users lasers to fight fraud, and a piano which demonstrates the potential of printed electronics – have been unveiled by Cambridge researchers.

6 Nov 2013

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Will feature its FinFET-ready DFY products that range from nano-scale SPICE modeling to giga-scale SPICE simulations at the 2013 ProPlus Technology Symposiums in Shanghai, China, and Hsinchu City, Taiwan. Dr. Chenming Hu, TSMC distinguished professor of the Graduate School at the University of California, Berkeley, will be the keynote presenter at the Shanghai symposium and offer a perspective on the 3D FinFET transistor he and his team invented.

5 Nov 2013

Omnetics' Nano Miniature Connectors Provide High-Quality Signal Integrity for High-Speed Gigabit Signal Processing

Omnetics' Nano miniature connectors are designed and connected to impedance-controlled cable systems to provide high-quality signal integrity for high-speed Gigabit signal processing needs between components and systems in highly rugged environments. For more information, see http://www.omnetics.com/products/bilobe-dualrow/

From Omnetics Connector Corporation 4 Nov 2013

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The module is fully compliant with the latest e•MMCTM [1] standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Mass production will start from the end of November.

31 Oct 2013

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

Professor Angelika Kühnle and her work group at the Institute of Physical Chemistry at Johannes Gutenberg University Mainz (JGU) are participating in a new EU project focusing on information and communication technology. Over the next four years, a total of eight partners from six European countries will be involved in the "Planar Atomic and Molecular Scale Devices" (PAMS) project.

30 Oct 2013

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

sureCore Ltd has announced that it has taped out its low power SRAM IP demonstrator chip in STMicroelectronics’ 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) process. The device will validate the benefits of sureCore’s patented array control and sensing scheme, which significantly lowers active power consumption to deliver greater than 50% power savings compared to current offerings in the same process.

30 Oct 2013

Abaxis Inc. and Lamdagen Corporation Announce Agreement to Integrate Plasmonic ELISA Technology onto Rotor-based Platforms

Abaxis, Inc., a medical products company manufacturing point-of-care blood instrumentation and consumables to the medical, research and veterinary markets, and privately-held LamdaGen Corporation, an optical biosensor co...

From LamdaGen Corporation 30 Oct 2013

University of Perugia and Grafen Co. Discover Efficient Method to Fabricate Graphene-printed Electronics

Scientists at University of Perugia, Italy in collaboration with Grafen Co. have discovered practical and cheap method to fabricate graphene based printed electronics.

From Grafen Chemical Industries 25 Oct 2013

Spreadtrum Licenses ARM Artisan Physical IP for SoC Designs Targeting 28nm Process

ARM and Spreadtrum, a leading fabless semiconductor provider in China, today announced a sweeping license agreement providing Spreadtrum with the full range of ARM® Artisan® physical IP, including POP™ IP, for the broad range of IC foundry and process varieties of 28nm that ARM supports to deliver the most flexible manufacturing options.

25 Oct 2013

Team to Expand Healthcare Applications for Silicon Nanotech at Imec and Johns Hopkins University

Researchers and physicians at Johns Hopkins University will collaborate with the nanoelectronics R&D center imec to advance silicon applications in healthcare, beginning with development of a device to enable a broad...

From IMEC 24 Oct 2013

Nanoelectronics News

Researchers Create Transparent, Flexible Piano Using Graphene-Based Ink

ProPlus Design Solutions to Feature FinFET-Ready DFY Products at Technology Symposiums

Omnetics' Nano Miniature Connectors Provide High-Quality Signal Integrity for High-Speed Gigabit Signal Processing

Toshiba Unveils New Embedded NAND Flash Memory Modules with 19nm Process Technology

PAMS Project Aims to Design Sub-Nanometer Range Electronic Components

sureCore’s SRAM IP Demonstrator Chip Taped Out in STMicroelectronics’ 28nm FD-SOI Process

Abaxis Inc. and Lamdagen Corporation Announce Agreement to Integrate Plasmonic ELISA Technology onto Rotor-based Platforms

University of Perugia and Grafen Co. Discover Efficient Method to Fabricate Graphene-printed Electronics

Spreadtrum Licenses ARM Artisan Physical IP for SoC Designs Targeting 28nm Process

Team to Expand Healthcare Applications for Silicon Nanotech at Imec and Johns Hopkins University

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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