Researchers in electrical and computer engineering at University of California, Santa Barbara have introduced and modeled an integrated circuit design scheme in which transistors and interconnects are monolithically patterned seamlessly on a sheet of graphene, a 2-dimensional plane of carbon atoms. The demonstration offers possibilities for ultra energy-efficient, flexible, and transparent electronics.
Advantest Corporation today announced that it has logged its first three orders for its new EB (electron beam) lithography system, the F7000, from the University of Tokyo, the University of Kyoto, and a semiconductor industry customer. The systems will be shipped within the fiscal year ending March 2014.
Solar cells that produce electricity 24/7, not just when the sun is shining. Mobile phones with built-in power cells that recharge in seconds and work for weeks between charges.
Xilinx, Inc. and TSMC today announced production release of the Virtex®-7 HT family, the industry's first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC's Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device.
Based on its recent analysis of the Lab-on-a-Chip (LOC) nanodevices market, Frost & Sullivan recognizes Ostendum R&D BV (Ostendum) with the 2013 European Frost & Sullivan Award for Technology Innovation Leadership. Ostendum is a group of companies focused on the development and production of fast, highly sensitive, portable, easy-to-use and cost-effective biosensors for the instantaneous detection of micro-organisms and biomolecules, including biomarkers, proteins and nucleic acids.
Materials in lithium ion battery electrodes expand and contract during charge and discharge. These volume changes drive particle fracture, which shortens battery lifetime. A group of ETH and PSI scientists have quantified this effect for the first time using high-resolution 3D movies recorded using x-ray tomography at the Swiss Light Source.
IEEE (Institute of Electrical and Electronics Engineers) NMDC (Nanotechnology Materials and Devices Conference) 2013 kicked off, October 7, at Cheng Kung Hall, National Cheng Kung University (NCKU), southern Taiwan, with nearly 250 scholars and experts from 20 countries including USA, UK, Italy, Australia, Canada, Korea, and Japan.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that it has collaborated with TSMC to provide support for voltage-dependent design rules in TSMC's 16-nm Custom Design Reference Flow.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC awarded Synopsys its Open Innovation Platform "Partner of the Year 2013" for joint development of 16-nanometer (nm) FinFET design infrastructure.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced a suite of ultra-fast, low-power analog intellectual property (IP) products designed to enable the next generation of high-speed wired and wireless communications applications. These new products uniquely meet the needs of designers working with emerging high-speed protocols such as WiGig (802.11ad), which runs on a 60 GHz spectrum with potential data throughput up to 7Gbps, as well as LTE and LTE Advanced.
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