Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that it has collaborated with TSMC to provide support for voltage-dependent design rules in TSMC's 16-nm Custom Design Reference Flow.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC awarded Synopsys its Open Innovation Platform "Partner of the Year 2013" for joint development of 16-nanometer (nm) FinFET design infrastructure.
Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced a suite of ultra-fast, low-power analog intellectual property (IP) products designed to enable the next generation of high-speed wired and wireless communications applications. These new products uniquely meet the needs of designers working with emerging high-speed protocols such as WiGig (802.11ad), which runs on a 60 GHz spectrum with potential data throughput up to 7Gbps, as well as LTE and LTE Advanced.
Vishay Intertechnology, Inc. today introduced a new precision automotive thin film chip resistor featuring high-temperature operation to +155 °C with 100 % power, derated linearly to 0 mW power at +250°C. Providing a nearly 100 °C extension in operating temperature range over traditional thin film chip resistors, the AEC-Q200-qualified PATT offers a low absolute TCR as low as ± 25 ppm/°C and laser-trimmed tolerances down to ±0.1 %.
XMC, a fast growing specialty foundry, today announced a licensing agreement with IBM under which XMC will license semiconductor process technology including underlying patents for several of IBM's production-proven advanced manufacturing offerings.
Intermolecular, Inc. and the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.
Research and Markets has announced the addition of the "Global Nanoelectromechanical Systems (NEMS) Market (2012 - 2022) by Applications, Products, Components, Materials" report to their offering.
Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that TSMC has awarded the company with the OIP Partner of the Year Award 2013 for Joint Development of 16FinFET Design Infrastructure. Berkeley Design Automation was selected based on the company’s deep technical expertise and the Analog FastSPICE™ Platform’s proven technology for 16nm FinFET circuit verification.
The market for supercapacitors will more than double to $836 million in 2018, up from $466 million in 2013, according to Lux Research. An emerging energy storage solution that bridges the gap between conventional capacitors and rechargeable batteries, supercapacitors will grow based mainly on adoption in transportation applications like hybrid buses and micro-hybrids. Consumer electronics and wind turbines make up the other significant opportunities.
Cambrios Technologies Corporation, the leader in silver nanowire-based solutions for the transparent and flexible conductor markets, today announced that consumer electronics (CE) giant Lenovo has selected Cambrios’ ClearOhm® technology for Lenovo’s 20-inch class All-in-One (AIO) computer, the Lenovo Flex 20.
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