Nanoelectronics News

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New Report on Forces Driving Thin Film Battery Market

Research and Markets has announced the addition of a new report "Solid State Thin Film Battery: Market Shares, Strategies, and Forecasts, Worldwide, Nanotechnology, 2013 to 2019" to their offering.

26 Jul 2013

Samsung Commences Mass Production of 3GB LPDDR3 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the industry's first mass production of three gigabyte (GB) low power double data rate 3 (LPDDR3) mobile DRAM, the highest density mobile memory solution for next-generation smartphones, which will bring a generation shift to the market from the 2GB packages that are widely used in current mobile devices.

26 Jul 2013

Imec, STFC and Fraunhofer IIS Announce EU’s Continued Support of Europractice IC Services

Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another 3 years under the FP7 program.

26 Jul 2013

Berkeley Design Automation’s Analog FastSPICE Platform with Nanometer Accuracy Adopted by PixArt Imaging

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that PixArt Imaging Inc., a leading advanced digital imaging IC design company, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization, full-circuit verification, and device noise analysis of their image sensor designs.

24 Jul 2013

UMC Implements SuVolta’s DDC Technology in 28nm High-K/Metal Gate Process

United Microelectronics Corporationand SuVolta, Inc., today announced joint technology development of a 28nm process that integrates SuVolta’s Deeply Depleted Channel™ (DDC) transistor technology into UMC's 28nm High-K Metal Gate (HKMG) high-performance mobile (HPM) process.

24 Jul 2013

Ultratech Laser Spike Annealing Technology Selected as Primary Tool for Global 450-mm Consortium

Ultratech, Inc., a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that its laser spike annealing (LSA) technology has been selected as a primary 450-mm millisecond annealing tool for the Global 450-mm Consortium (G450C), headquartered at SUNY's College of Nanoscale Science and Engineering (CNSE) in Albany, NY.

24 Jul 2013

MagnaChip Enters Into SOI RF CMOS Technology Transfer Agreement with National Nano Fab Center

MagnaChip Semiconductor Corporation ("MagnaChip"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, and the National Nano Fab Center ("NNFC") have entered into an SOI RF CMOS technology transfer agreement which combines MagnaChip's specialty manufacturing expertise with NNFC's robust RF technology.

23 Jul 2013

New Report on Barrier Films for Flexible Electronics

Research and Markets has announced the addition of the "Barrier Films for Flexible Electronics 2013-2023: Needs, Players, Opportunities" report to their offering.

From Research and Markets 20 Jul 2013

Rochester Kodak Building to be Transformed into CNSE PV Development Facility

Governor Andrew M. Cuomo today announced that SUNY’s College of Nanoscale Science and Engineering (CNSE) will revitalize a vacant Kodak cleanroom building in Rochester by transforming it into a first-of-its-kind CNSE Photovoltaic Manufacturing and Technology Development Facility (CNSE MDF) for crystalline silicon photovoltaics, part of a $100 million initiative that will attract solar energy jobs and companies to the Greater Rochester Area.

From College of Nanoscale Science and Engineering, University at Albany 19 Jul 2013

Complete 28-nanometer Data Converter IP Portfolio from Synopsys

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of its 28-nanometer (nm) data converter IP portfolio,which includes DesignWare® analog-to-digital converters (ADCs), digital-to-analog converters (DACs) and integrated PLLs.

From Synopsys, Inc. 19 Jul 2013

Nanoelectronics News

New Report on Forces Driving Thin Film Battery Market

Samsung Commences Mass Production of 3GB LPDDR3 Mobile DRAM

Imec, STFC and Fraunhofer IIS Announce EU’s Continued Support of Europractice IC Services

Berkeley Design Automation’s Analog FastSPICE Platform with Nanometer Accuracy Adopted by PixArt Imaging

UMC Implements SuVolta’s DDC Technology in 28nm High-K/Metal Gate Process

Ultratech Laser Spike Annealing Technology Selected as Primary Tool for Global 450-mm Consortium

MagnaChip Enters Into SOI RF CMOS Technology Transfer Agreement with National Nano Fab Center

New Report on Barrier Films for Flexible Electronics

Rochester Kodak Building to be Transformed into CNSE PV Development Facility

Complete 28-nanometer Data Converter IP Portfolio from Synopsys

Nanopore-Based Sensor Enables Rapid and Precise Disease Diagnosis

Combining Nanofluids and Turbulators for Sustainable Energy

Breakthrough in 2D Material Growth Opens Doors to Cleaner Energy and Next-Generation Technology

Enhancing Material Properties through Nanotube Encapsulation

Multiscale Force Sensing with Photon-Avalanching Nanocrystals

Conversations on AFM: Applications of BioAFM in Life Science

Conversations on AFM: The Technology and History Behind AFM and SPM

Recent Advances in High-Speed Atomic Force Microscopy to Improve Research Into Protein Dynamics

Sponsored Content

Characterization of Active Pharmaceutical Ingredients, Injectables, and Proteins

The Future of Wound Care: Why Nanofibers are Key to Accelerated Healing

The Evolution of Lipid Nanoparticles

How Emulsion Electrospinning is Transforming Materials