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Oxford Instruments Launches Four New Modules for its AZtec Microanalysis System at M&M 2013

Oxford Instruments, a leading supplier of microanalysis systems, has launched four new modules for its AZtec Microanalysis System at M&M 2013. The new modules enable Large Area Mapping, the use of multiple X-MaxN SDD...

From Oxford Instruments NanoAnalysis 6 Aug 2013

XMC to License Spansion's Floating Gate NOR Flash Technology

Spansion Inc., a global leader in Flash memory-based embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced an agreement for XMC to license Spansion's floating gate NOR Flash technology. The agreement expands the companies' 300mm manufacturing partnership of Spansion's proprietary 65nm, 45nm and 32nm MirrorBit® Flash memory technology.

3 Aug 2013

Sidense Introduces SHF OTP Memory for ICs Developed in 40nm, 28nm and 20nm Geometries

Sidense Corp., a leading developer of Logic Non-Volatile Memory (LNVM) OTP IP cores, today announced its SHF (Sidense Hiper Fuse) one-time programmable (OTP) memory for ICs developed in advanced processes at 40nm, 28nm, 20nm and smaller geometries. Sidense SHF 1T-OTP has already been qualified in 40nm processes in both G and LP variants, and is completing qualification in multiple 28nm processes with 20nm qualification to follow.

2 Aug 2013

Scientists Create Fully Controllable, Self-Integrating Nanowires for Producing Nanoelectronic Components

Researchers working with tiny components in nanoelectronics face a challenge similar to that of parents of small children: teaching them to manage on their own. The nano-components are so small that arranging them with external tools is impossible. The only solution is to create conditions in which they can be “trusted” to assemble themselves.

1 Aug 2013

Nanotronics Ship nSPEC Wafer Inspection Tool to Kyma Technologies

In May of 2013, Nanotronics Imaging installed an nSPEC® at Kyma Technologies in Raleigh, North Carolina. The companies have quickly established a collaborative partnership after initially meeting in early 2013.

From Nanotronics Imaging 29 Jul 2013

Algo-Logic Systems Introduces 3rd Generation TCP Endpoint with Nanosecond Ultra-Low-Latency

Algo-Logic Systems, a recognized leader in providing hardware-accelerated, deterministic, ultra-low-latency products, systems and solutions for accelerated finance, packet processing and embedded system industries, today announced availability of their new 3rd Generation TCP Endpoint.

26 Jul 2013

New Report on Forces Driving Thin Film Battery Market

Research and Markets has announced the addition of a new report "Solid State Thin Film Battery: Market Shares, Strategies, and Forecasts, Worldwide, Nanotechnology, 2013 to 2019" to their offering.

26 Jul 2013

Samsung Commences Mass Production of 3GB LPDDR3 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the industry's first mass production of three gigabyte (GB) low power double data rate 3 (LPDDR3) mobile DRAM, the highest density mobile memory solution for next-generation smartphones, which will bring a generation shift to the market from the 2GB packages that are widely used in current mobile devices.

26 Jul 2013

Imec, STFC and Fraunhofer IIS Announce EU’s Continued Support of Europractice IC Services

Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another 3 years under the FP7 program.

26 Jul 2013

Berkeley Design Automation’s Analog FastSPICE Platform with Nanometer Accuracy Adopted by PixArt Imaging

Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that PixArt Imaging Inc., a leading advanced digital imaging IC design company, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization, full-circuit verification, and device noise analysis of their image sensor designs.

24 Jul 2013

Nanoelectronics News

Oxford Instruments Launches Four New Modules for its AZtec Microanalysis System at M&M 2013

XMC to License Spansion's Floating Gate NOR Flash Technology

Sidense Introduces SHF OTP Memory for ICs Developed in 40nm, 28nm and 20nm Geometries

Scientists Create Fully Controllable, Self-Integrating Nanowires for Producing Nanoelectronic Components

Nanotronics Ship nSPEC Wafer Inspection Tool to Kyma Technologies

Algo-Logic Systems Introduces 3rd Generation TCP Endpoint with Nanosecond Ultra-Low-Latency

New Report on Forces Driving Thin Film Battery Market

Samsung Commences Mass Production of 3GB LPDDR3 Mobile DRAM

Imec, STFC and Fraunhofer IIS Announce EU’s Continued Support of Europractice IC Services

Berkeley Design Automation’s Analog FastSPICE Platform with Nanometer Accuracy Adopted by PixArt Imaging

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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