Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation (UMC) has adopted the Cadence® “in-design” and signoff design-for-manufacturing (DFM) flows to perform physical signoff and electrical variability optimization for 28nm designs.
e2v, a leading global provider of hi-rel semiconductor solutions, has announced the availability of their P2041 and P3041 processors. These are extended-reliability versions of Freescale's quad core QorIQ™ processors for power-sensitive and computation intensive applications for demanding environments such as aerospace and defence.
Micro and Nano Technologies (MNT) for space applications will be the theme of this important meeting. It will take place in the new Swiss Tech Convention Center on 10-13 June 2014 and will host members from national delegations, space agencies, space and MNT industries, research centrers and universities.
Scientists of Natcore Technology Inc., in collaboration with researchers at Rice University have successfully fabricated the first inorganic flexible thin film solar cell by solution processes. The work was reported in a recent issue of the journal Physical Chemistry Chemical Physics published by the Royal Society of Chemistry, volume 15, pages 3930-3938.
The Nanotechnology Knowledge Transfer Network, one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, is pleased to announce details of an exhibition it has organised at the Department of Business, Innovation and Skills (BIS) headquarters in London.
Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.
Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, officially opens an eight-inch wafer fabrication line in Bucheon, Korea. This new Fab symbolizes the company's focus on innovative power semiconductor solutions, as well as its investment in improving quality and responding to evolving market dynamics.
Xilinx, Inc. announced two more industry firsts at 20nm, expanding on a series of industry innovations started at 28nm. Xilinx has now taped out the semiconductor industry's first 20nm device, and the PLD industry's first 20nm All Programmable device.
The remarkable material graphene promises a wide range of applications in future electronics that could complement or replace traditional silicon technology. Researchers of the Electronic Properties of Materials Group at the University of Vienna have now paved the way for the integration of graphene into the current silicide based technology. They have published their results in the new open access journal of the Nature Publishing group, Scientific Reports.
SEMATECH today announced that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
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