The Nanotechnology Knowledge Transfer Network, one of the UK’s primary knowledge-based networks for Micro and Nanotechnologies, is pleased to announce details of an exhibition it has organised at the Department of Business, Innovation and Skills (BIS) headquarters in London.
Entegris, Inc. announced that its handling and shipping products for the safe, reliable transport and processing of 450 mm wafers were selected by the Global 450 mm Consortium (G450C), headquartered at SUNY’s College of Nanoscale Science and Engineering (CNSE) in Albany, New York, for use in the development of 450 mm wafer technology.
Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, officially opens an eight-inch wafer fabrication line in Bucheon, Korea. This new Fab symbolizes the company's focus on innovative power semiconductor solutions, as well as its investment in improving quality and responding to evolving market dynamics.
Xilinx, Inc. announced two more industry firsts at 20nm, expanding on a series of industry innovations started at 28nm. Xilinx has now taped out the semiconductor industry's first 20nm device, and the PLD industry's first 20nm All Programmable device.
The remarkable material graphene promises a wide range of applications in future electronics that could complement or replace traditional silicon technology. Researchers of the Electronic Properties of Materials Group at the University of Vienna have now paved the way for the integration of graphene into the current silicide based technology. They have published their results in the new open access journal of the Nature Publishing group, Scientific Reports.
SEMATECH today announced that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
Nikon Corporation announced a newly established partnership agreement with the Research Foundation for the State University of New York (SUNY). Through this program, Nikon will join the Global 450 mm Consortium (G450C) headquartered at the SUNY College of Nanoscale Science and Engineering (CNSE).
Semicon West 2013 will be held July 9-11 at the Moscone Center in San Francisco, and will feature over 500 exhibitors, 50 hours of conference programs and more than 30,000 industry attendees. In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.
In an effort to address the increasing complexity associated with advanced node designs, Cadence Design Systems, Inc., today announced that TSMC has expanded collaboration with Cadence on the Virtuoso custom and analog design platform to design and verify its own cutting-edge IP.
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