Nanoelectronics News

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Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura® RP Epi system.

9 Jul 2013

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

From IMEC 8 Jul 2013

Researchers Successfully Create Perfect One-Dimensional Molecular Wires

Researchers of MESA+, the research institute for nanotechnology of the University of Twente, in cooperation with researchers of the University of Strasbourg and Eindhoven University of Technology, are the first to successfully create perfect one-dimensional molecular wires of which the electrical conductivity can almost entirely be suppressed by a weak magnetic field at room temperature.

5 Jul 2013

Researchers Discover Graphene has Heat-Dissipating Effect on Silicon-Based Electronics

A layer of graphene can reduce the working temperature in hotspots inside a processor by up to 25 percent – which can significantly extend the working life of computers and other electronics. An international group of researchers, headed by Chalmers University of Technology in Sweden, are the first in the world to show that graphene has a heat dissipating effect on silicon based electronics.

4 Jul 2013

Research and Markets Adds Printed, Organic and Flexible Electronics Report to its Offering

Research and Markets has announced the addition of the "Introduction to Printed, Organic and Flexible Electronics" report to their offering.

4 Jul 2013

Jordan Valley Ships JVSensus System to Asian Foundry for Sub 20nm Node Process Control

Jordan Valley, a leading supplier of X-ray based in-line metrology and defect detection systems for advanced semiconductor manufacturing lines, announced today that it shipped a JVSensus™ system to a leading Asian semiconductor foundry manufacturer, who have adopted the tool as part of its process.

4 Jul 2013

SUNY’s CNSE to Play Leading Role in SEMICON West 2013 and Intersolar North America 2013 Conferences

Demonstrating the impact of Governor Andrew M. Cuomo’s innovation-driven strategy that is positioning New York as a global leader in two critical 21st century industries, SUNY’s College of Nanoscale Science and Engineering (CNSE) announced today that it will play a leading role in this year’s SEMICON West 2013 and Intersolar North America 2013 conferences, spearheading a series of presentations and workshops that will highlight the ongoing progress of the Global 450mm Consortium (G450C) and U.S. Photovoltaic Manufacturing Consortium (PVMC), both headquartered at CNSE.

From College of Nanoscale Science and Engineering, University at Albany 2 Jul 2013

Scifiniti Raises $10M to Market Ultra-Low Cost, Drop-In Replacement PV Silicon Wafer

Scifiniti announced today that the company has raised $10 million in Series B funding from current investors Alloy Ventures, Firelake Capital, I2BF Global Ventures and Peninsula Ventures. The money will be used to bring Scifiniti’s first product, SmartWafer™, to market. SmartWafer is an ultra-low cost, drop-in replacement photovoltaic (PV) silicon wafer.

2 Jul 2013

STATS ChipPAC Granted its 1,000th Patent by USPTO

STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company”), a leading provider of advanced semiconductor packaging and test services, today announced that it has been granted its 1,000th patent by the U.S. Patent and Trademark Office (USPTO).

2 Jul 2013

Comprehensive Report on Printed, Organic & Flexible Electronics Market

Research and Markets has announced the addition of the "Printed, Organic & Flexible Electronics Forecasts, Players & Opportunities 2013-2023" report to their offering.

29 Jun 2013

Nanoelectronics News

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Researchers Successfully Create Perfect One-Dimensional Molecular Wires

Researchers Discover Graphene has Heat-Dissipating Effect on Silicon-Based Electronics

Research and Markets Adds Printed, Organic and Flexible Electronics Report to its Offering

Jordan Valley Ships JVSensus System to Asian Foundry for Sub 20nm Node Process Control

SUNY’s CNSE to Play Leading Role in SEMICON West 2013 and Intersolar North America 2013 Conferences

Scifiniti Raises $10M to Market Ultra-Low Cost, Drop-In Replacement PV Silicon Wafer

STATS ChipPAC Granted its 1,000th Patent by USPTO

Comprehensive Report on Printed, Organic & Flexible Electronics Market

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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