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New Report Sheds Light on Global Market for Supercapacitors

Reportlinker.com announces that a new market research report is available in its catalogue: Supercapacitors: World Markets, Technologies & Opportunities: 2013-2018

28 May 2013

Mentor Graphics Collaborates with Lumerical Solutions and OpSIS to Develop PDK for Silicon Photonics Process

Mentor Graphics Corp., a leader in electronic design automation, today announced it has teamed with OpSIS and Lumerical Solutions to develop a complete EDA-style, full flow process design kit (PDK) for the OpSIS IME (Institute of Microelectronics) silicon photonics process.

24 May 2013

United Microelectronics Sets up Center of Excellence for Specialty Technologies at Singapore

United Microelectronics Corporation ("UMC"), today announced that the company has established Fab 12i in Singapore as its "Center of Excellence" to spearhead the company's R&D and manufacturing for advanced specialty process technologies.

From United Microelectronics Corporation 24 May 2013

Axcelis Delivers Novel Purion Platform for Sub-16 nm Devices to Asian Semiconductor Manufacturer

Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it has shipped the new Purion M medium current implanter, to a major semiconductor manufacturer located in Asia.

24 May 2013

Toshiba Develops 19 nm Process for Mass Production of 2-bit-per-cell 64 Gigabit NAND Memory Chips

Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month.

22 May 2013

Xilinx 28 nm Devices Clear Rigorous Protocol, Electrical and Interoperability Tests at PCI-SIG Event

Xilinx, Inc. today announced that its All Programmable 7 series FPGAs and Zynq®-7000 All Programmable SoCs have achieved full PCI Express® compliance and are now listed on the PCI-SIG integrator's list.

21 May 2013

Northwestern University Researchers Develop Technique to Print Bendable, High-Conductivity Graphene Layers

Imagine a bendable tablet computer or an electronic newspaper that could fold to fit in a pocket. The technology for these devices may not be so far off. Northwestern University researchers have recently developed a graphene-based ink that is highly conductive and tolerant to bending, and they have used it to inkjet-print graphene patterns that could be used for extremely detailed, conductive electrodes.

21 May 2013

Columbia Engineering Researchers Use Miniaturized Electronics for Measuring Ion-Channel Protein Activity

The miniaturization of electronics continues to create unprecedented capabilities in computer and communications applications, enabling handheld wireless devices with tremendous computing performance operating on battery power. This same miniaturization of electronic systems is also creating new opportunities in biotechnology and biophysics.

21 May 2013

SanDisk Commences Customer Sampling of Flash Memory Products Based on 1Ynm Process Technology

SanDisk Corporation, a global leader in flash memory storage solutions, today announced it has begun customer sampling of flash memory products based on its industry-leading 1Ynm process technology, which represents its second generation 19 nanometer (nm) manufacturing technology.

21 May 2013

Nanoantenna Pattern Enables New Way of Turning Infrared Light into Mechanical Action

A team of University of Pennsylvania engineers has used a pattern of nanoantennas to develop a new way of turning infrared light into mechanical action, opening the door to more sensitive infrared cameras and more compact chemical-analysis techniques.

18 May 2013

Nanoelectronics News

New Report Sheds Light on Global Market for Supercapacitors

Mentor Graphics Collaborates with Lumerical Solutions and OpSIS to Develop PDK for Silicon Photonics Process

United Microelectronics Sets up Center of Excellence for Specialty Technologies at Singapore

Axcelis Delivers Novel Purion Platform for Sub-16 nm Devices to Asian Semiconductor Manufacturer

Toshiba Develops 19 nm Process for Mass Production of 2-bit-per-cell 64 Gigabit NAND Memory Chips

Xilinx 28 nm Devices Clear Rigorous Protocol, Electrical and Interoperability Tests at PCI-SIG Event

Northwestern University Researchers Develop Technique to Print Bendable, High-Conductivity Graphene Layers

Columbia Engineering Researchers Use Miniaturized Electronics for Measuring Ion-Channel Protein Activity

SanDisk Commences Customer Sampling of Flash Memory Products Based on 1Ynm Process Technology

Nanoantenna Pattern Enables New Way of Turning Infrared Light into Mechanical Action

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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