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Bruker Introduces New AFM Configuration for Semiconductor Characterization

Bruker announced today the release of the Dimension Icon® SSRM-HR, a new atomic force microscope (AFM) configuration including the Scanning Spreading Resistance Microscopy (SSRM) module, designed specifically for high-resolution (HR) semiconductor characterization.

From Bruker Nano Surfaces and Metrology 5 Apr 2013

Omnetics Offers Watertight Nano-Sized Connectors for Miniature Electronics Applications

Many of the world's smallest and ruggedized ultra-miniature circular connectors are used within medical, commercial and military applications that require the best electrical performance for portable and miniature electronics. To ensure integrity, Omnetics used gold plated contacts that are polarized and shrouded by its unique liquid crystal polymer insulators.

From Omnetics Connector Corporation 4 Apr 2013

Applied Nanotech to Present Advancements in Inks and Pastes at Printed Electronics Europe 2013

Applied Nanotech Holdings, Inc. announced that its subsidiary, Applied Nanotech, Inc., will be presenting its latest advancements in inks and pastes for printed electronic applications at the prestigious 10th International Conference and Trade Show on printed electronics organized by IDTechEx in Berlin, Germany April 17-18, 2013.

3 Apr 2013

ProPlus Design Launches NanoSpice High-Performance Parallel SPICE Simulator for Giga-Scale Circuit Simulation

ProPlus Design Solutions, Inc., the global leader for SPICE modeling solutions and the leading technology provider for Design-for-Yield (DFY) applications, today launched NanoSpice™, the next-generation high-capacity, high-performance parallel SPICE simulator for giga-scale circuit simulation.

3 Apr 2013

Ferrotec Introduces Ultra-High Efficiency Electron Beam Metallization System for Lift-Off Compound Semiconductor Applications

The Temescal Division of Ferrotec Corporation, a global supplier of materials, components, and precision system solutions and the leading manufacturer of electron beam evaporation systems, today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.

3 Apr 2013

Vishay Releases High-Speed Nano-Scale Infrared Emitters in SMD Packages

Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the introduction of high-power, high-speed 850 nm, 890 nm, and 940 nm infrared emitters in gullwing, reverse gullwing, and side-view surface-mount packages with wide-view dome lenses.

2 Apr 2013

Penn State Nanosatellite to Be Flown as Auxiliary Payload for NASA Launch

A Penn State project is one of 24 small satellites selected by NASA to fly as auxiliary payloads planned for launch between 2014 and 2016, the agency recently announced.

30 Mar 2013

GrafTech to Provide Thermal Management Solutions for Low Earth Orbiting Nanosatellite Integrated Defense Autonomous System Program

GrafTech International today announced that its Engineered Solutions (ES) business segment has won another contract to provide thermal management solutions in support of space research and exploration.

30 Mar 2013

SiTime Introduces SiT15xx Family of 32 kHz MEMS Oscillators

SiTime Corporation, the fastest growing semiconductor company, today introduced the SiT15xx family of 32 kHz MEMS oscillators that replace legacy quartz crystal resonators. This new family is targeted at mobile applications, such as smartphones and tablets, which require small size and low power.

28 Mar 2013

Cascade Microtech among Finalists for Oregon Technology Awards

Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, was recently named an Oregon Technology Award finalist in the category "Technology Company of the Year - Enterprise."

27 Mar 2013

Nanoelectronics News

Bruker Introduces New AFM Configuration for Semiconductor Characterization

Omnetics Offers Watertight Nano-Sized Connectors for Miniature Electronics Applications

Applied Nanotech to Present Advancements in Inks and Pastes at Printed Electronics Europe 2013

ProPlus Design Launches NanoSpice High-Performance Parallel SPICE Simulator for Giga-Scale Circuit Simulation

Ferrotec Introduces Ultra-High Efficiency Electron Beam Metallization System for Lift-Off Compound Semiconductor Applications

Vishay Releases High-Speed Nano-Scale Infrared Emitters in SMD Packages

Penn State Nanosatellite to Be Flown as Auxiliary Payload for NASA Launch

GrafTech to Provide Thermal Management Solutions for Low Earth Orbiting Nanosatellite Integrated Defense Autonomous System Program

SiTime Introduces SiT15xx Family of 32 kHz MEMS Oscillators

Cascade Microtech among Finalists for Oregon Technology Awards

Gold Nanoparticles to Restore Vision in Retinal Disorders

Levidian and Zentek Seek to Establish Graphene-Integrated Filter Manufacturing Facility in the Middle East to Advance Cleaner, Safer Air

Biochar-Modified Titanium Dioxide Nanocomposites for Enhanced Water Treatment

New Nanocage Material Removes Up to 90% of Toxic PFAS from Water

Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications

Overcoming Nanogold Production Challenges

Electrospinning and the Future of Nanotechnology

How Electrospinning is Shaping the Future of Nanotechnology

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