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Nano Composites Developer, 3D Systems Wins PA RAMP Award

3D Systems announced today that its Paramount team was selected by Pennsylvania as one of the state's Research for Advanced Manufacturing in Pennsylvania, RAMP, awardees.

13 Dec 2012

Micron Ships 45nm 1Gb PCM-Based Multichip Package Solution for Mobile Devices

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the addition of a new product to its Phase Change Memory (PCM) portfolio. With high-volume shipments of its 45-nanometer (nm), 1-gigabit (Gb) PCM-based multichip package (MCP) solution for mobile devices well underway, the company is now sampling a 512-megabit (Mb) PCM plus 512Mb LPDDR2 MCP that offers greater flexibility in terms of application requirements.

From Micron Technology, Inc. 12 Dec 2012

Researchers Develop Fully Stretchable Supercapacitor Composed of Carbon Nanotube Macrofilms

Electronic devices become smaller, lighter, faster and more powerful with each passing year. Currently, however, electronics such as cell phones, tablets, laptops, etc., are rigid. But what if they could be made bendable or stretchy?

12 Dec 2012

Intel Introduces Low-Power, 64-Bit Server-Class System-on-Chip for High-Density Microservers

Intel Corporation introduced the Intel® Atom™ processor S1200 product family today, delivering the world’s first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

12 Dec 2012

STMicroelectronics Offers 28nm Fully-Depleted-Silicon-On-Insulator Technology Platform

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today another step towards the availability of its 28nm FD-SOI Technology Platform, now open for pre-production from its Crolles (France) 300mm manufacturing facility.

11 Dec 2012

Indium Gallium Arsenide Compound Transistor Challenges Silicon’s Crown

Silicon’s crown is under threat: The semiconductor’s days as the king of microchips for computers and smart devices could be numbered, thanks to the development of the smallest transistor ever to be built from a rival material, indium gallium arsenide.

10 Dec 2012

3-D Transistors with Indium-Gallium-Arsenide Nanowires May Enable More Compact Computers

A new type of transistor shaped like a Christmas tree has arrived just in time for the holidays, but the prototype won't be nestled under the tree along with the other gifts.

6 Dec 2012

WF Nanotechnology Center Develops Nearly Indestructible Molded Plastic Lights

Decking your home with holiday lights soon won’t include the hassle of burnt-out bulbs or broken strands.

6 Dec 2012

Ferrotec Temescal’s Novel Deposition Process Improves Uniformity in Wafer-Coating Applications

The Temescal Division of Ferrotec Corporation, a global supplier of materials, components, and precision system solutions and the leading manufacturer of electron beam evaporative coating systems, today announced a major process breakthrough in electron beam metallization for lift-off compound semiconductor applications.

6 Dec 2012

Minalogic Co-Hosts Samsung Delegation’s Visit to Grenoble

Minalogic, the global competitive cluster dedicated to micro- and nanotechnologies and embedded software, co-hosted a visit by a delegation from Samsung Electronics earlier this month.

5 Dec 2012